SN74HC04N Electronic IC Chips integrated components Hex inverter
74HC04; 74HCT04
Hex inverter
FEATURES
• Complies with JEDEC standard no. 8-1A
• ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V.
• Specified from −40 to +85 °C and −40 to +125 °C.
DESCRIPTION
The 74HC/HCT04 are high-speed Si-gate CMOS devices and are pin compatible with low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A. The 74HC/HCT04 provide six inverting buffers.
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25 °C; tr = tf ≤ 6.0 ns.
| SYMBOL | PARAMETER | CONDITIONS | TYPICAL | UNIT | |
| HC04 | HCT04 | ||||
| tPHL/tPLH | propagation delay nA to nY | CL = 15 pF; VCC = 5 V | 7 | 8 | ns |
| CI | input capacitance | 3.5 | 3.5 | pF | |
| CPD | power dissipation capacitance per gate | notes 1 and 2 | 21 | 24 | pF |
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
N = total load switching outputs;
Σ(CL × VCC2 × fo) = sum of the outputs.
2. For 74HC04: the condition is VI = GND to VCC.
For 74HCT04: the condition is VI = GND to VCC − 1.5 V.
Fig.1 Pin configuration DIP14, SO14 and (T)SSOP14.
Fig.2 Pin configuration DHVQFN14. Fig.3 Logic symbol.
Fig.4 IEC logic symbol. Fig.5 Logic diagram (one inverter).
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.