ChongMing Group (HK) Int'l Co., Ltd
                                                                                                           
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Since 2008
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AGN200A12Z Electronic IC Chip ULTRA-SMALL PACKAGE SLIM POLARIZED RELAY

Price Negotiable
Price: Negotiate
MOQ: 10pcs
Delivery Time: 1 day
Product Description

 

Stock Offer (Hot Sell)

Part No. Quantity Brand D/C Package
EL817B-F 12000 EL 16+ DIP
EL817C-F 12000 EVERLIGHT 16+ DIP
EL817S(A)(TA)-F 68000 EVERLIGHT 12+ SOP-4
EM639165TS-6G 7930 ETRONTECH 15+ TSOP-54
EM63A165TS-6G 13467 ETRONTECH 14+ TSOP-54
EM78P459AKJ-G 9386 EMC 15+ DIP-24
EMI2121MTTAG 5294 ON 15+ DFN
ENC28J60-I/SO 7461 MICROCHIP 16+ SOP-28
EP1C3T144C8N 3452 ALTERA 13+ QFP144
EP3C5F256C8N 2848 ALTERA 15+ BGA
EP3C80F780I7N 283 ALTERA 16+ BGA
EP9132 3575 EXPLORE 16+ TQFP-80
EPC1213LC-20 3527 ALT 03+ PLCC20
EPC1213PC8 8853 ALTERA 95+ DIP-8
EPC2LI20N 2794 ALTERA 13+ PLCC
EPM7032SLC44-10N 2472 ALTERA 13+ PLCC44
EPM7064SLC44-10N 2498 ATLERA 15+ PLCC
EPM7128SQC100-10N 1714 ALTERA 12+ QFP
ERA-1SM+ 3210 MINI 15+ SOT-86
ES1B-E3/61T 18000 VISHAY 14+ DO-214AC
ES2G-E3/52T 12000 VISHAY 16+ SMB
ES2J-E3/52T 12000 VISHAY 13+ DO-214AA
ES3J 12000 FSC 15+ SMC
ES56031S 3498 ES 16+ SOP-24
ESAD92-02 6268 FUIJ 16+ TO-3P
ESD112-B1-02EL E6327 23000   15+ TSLP-2-20
ESD5Z5.0T1G 9000 ON 13+ SOD-523
ESD5Z7.0T1G 12000 ON 16+ SOD-523
ESDA6V1SC5 51000 ST 15+ SOT23-5
ESP-12E 3991 AI 16+ SMT

 

 

ULTRA-SMALL PACKAGE SLIM POLARIZED RELAY

 

FEATURES

• Compact slim body saves space

Thanks to the small surface area of 5.7 mm × 10.6 mm .224 inch × .417 inch and low height of 9.0 mm .354 inch, the packaging density can be increased to allow for much smaller designs.

 

• Outstanding surge resistance.

Surge withstand between open contacts: 1,500 V 10×160 µs (FCC part 68) Surge withstand between contacts and coil: 2,500 V 2×10 µs (Bellcore)

 

• The use of twin crossbar contacts ensures high contact reliability.

AgPd contact is used because of its good sulfide resistance. Adopting low-gas molding material. Coil assembly molding technology which avoids generating volatile gas from coil.

 

• Increased packaging density

Due to highly efficient magnetic circuit design, leakage flux is reduced and changes in electrical characteristics from components being mounted close-together are minimized. This all means a packaging density higher than ever before.

 

• Nominal operating power: 140 mW

• Outstanding vibration and shock resistance.

Functional shock resistance: 750 m/s2 {75G}

Destructive shock resistance: 1,000 m/s2 {100G}

Functional vibration resistance: 10 to 55 Hz (at double amplitude of 3.3 mm .130 inch)

Destructive vibration resistance: 10 to 55 Hz (at double amplitude of 5 mm .197 inch)

 

 

TYPICAL APPLICATIONS

• Telephone exchange, transmission equipment

• Communications devices

• Measurement devices

• Home appliances, and audio/visual equipment

• Handheld and portable products

 

 

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company ChongMing Group (HK) Int'l Co., Ltd
Location Room 1204, DingCheng International Building, 518028 Futian District, SHENZHEN, CN
Contact Person Doris Guo

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