4 Layer ENIG Earphone Circuit Board SMD PCB Assembly

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: 5-8 days delivery

Brand: JIETENG

Product Description

circuit board Four-layer board six-layer board PCB board buried blind hole board

Essential details

Model Number:: PCB

Place of Origin:: Guangdong, China

Base Material:: FR4

Copper Thickness:: 12um--70um

Board Thickness:: 0.05-0.75mm

Min. Hole Size:: 0.1mm

Min. Line Width:: ±0.05mm

Min. Line Spacing:: ±0.05mm

Surface Finishing:: OSP,ENIG,Immersion Tin,Immersion silver

Solder mask color:: Yellow,Black,white,Green,Red,Blue

Silkscreen color:: white/black

Assembly Service:: SMD/DIP/BGA/COB component assembly

Products Description

Seq	Item	Standard	Special
1	Production Capability	Single-sided:20,000M²/Month	N/A
1	Production Capability	Double-sided/Multi-layers:10,000M²/Month	N/A
2	Base Material	Polyimide ( PI )	Polyester (PET)
3	Layers	Flexible Printed Circuit(FPC) Board:1~6layers	8Layer
3	Layers	Rigid-Flex Board:2~6layers	8Layer
4	Maximum Size	250*1200mm	500*1200mm
5	Maximum Thickness	0.75mm	N/A
6	Minumum Thickness	0.05mm	N/A
7	Product thickness tolerance	± 0.03mm	± 0.02mm
8	Copper Thickness	12um (1/3OZ),18um (1/2OZ) , 35um (1OZ), 70um (2oz)	6um(1/4OZ), 140um (4OZ)
9	Minimum Line Width/ Distance between stitchings	± 0.05mm	± 0.03mm
10	Stiffener material type	PI / FR4 / PET / Steel piece	N/A
11	Etching tolerance	± 0.02mm	N/A
12	Minimum Hole Diameter	0.1mm	N/A
13	Hole tolerance	PTH: +/- 0.05mm NPTH: +/-0.03mm	N/A
14	Outline profile	Punching , Laser cut	N/A
15	Outline Dimension tolerance	± 0.1mm	± 0.05mm
16	Solder mask color	Yellow,Black,white	Green,Red,Blue
17	Surface treatment	OSP: 0.2-0.5um ENIG: Au 0.03um - 0.15um Immersion Tin:0.5-1.5um Immersion silver: 0.1-1.2um Gold plating: Au 1-150U’’	HASL : 1- 20um
18	Thermal shock test	288 ± 5 ℃ , 10S , 3times	N/A
19	Environmental Requirement	ROHS	N/A

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Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company ShenZhen Jieteng Circuit Co., Ltd.

Location Building 1, Huafeng Science and Technology Park, No. 54 Guangtian Road, Luotian County community, Songgang Town, Bao'an District, Shenzhen City

Contact Person Sales Manager

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