3 Layer HDI Double Sided PCB Board Circuit Board Multilayer ISO9001
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
5-8days for delivery
Brand:
JIETENG
Product Description
Mobile Phone Power Motherboard HDI circuit board multi-layer arbitrary level circuit board
Essential details
| Item | Mass Production |
| Max Stencil Size | 1560mm*450mm |
| Min SMT Package | 0201 |
| Min IC Pitch | 0.3mm |
| Max PCB Size | 1200mm*400mm |
| Min PCB Thickness | 0.35mm |
| Min Chip Size | 001005 |
| Max BGA Size | 74mm*74mm |
| BGA Ball Pitch | 1.0-3.00 |
| BGA Ball Diameter | 0.2 - 1.0mm |
| QFP Lead Pitch | 0.2mm-2.54mm |
| SMT Capacity | 2 million points per day |
Similar Products
Related Videos
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
ShenZhen Jieteng Circuit Co., Ltd.
Location
Building 1, Huafeng Science and Technology Park, No. 54 Guangtian Road, Luotian County community, Songgang Town, Bao'an District, Shenzhen City
Contact Person
Sales Manager
