LED Substrate Grinding Wheels Metal Bonded Abrasives ISO14001

Price Negotiable

Price: USD 1 for one piece

MOQ: One piece

Delivery Time: 7-10 days

Brand: CAEC

Product Description

Grinding Wheels for LED Substrate

Application

The grinding wheels for LED substrate are mainly used for back thinning of 2”, 4” and 6”LED epitaxial wafers. They can be used steadily on the Japanese, Korean and Taiwanese grinders with high performance.

Workpiece: sapphire epitaxial wafer, SiC substrate epitaxial wafer, Si substrate epitaxial wafer.

Material of workpiece: Synthetic sapphire, SiC ,single crystal silicon.

Grinders: WEC , GALAXY ,SPEEDFAM , NTS , SHUWA , OKAMOTO.

Main Features

Good surface quality with high efficiency

No deep scratch and crash

Long life and low cost

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Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company China Abrasives Industry Hainan Corporation

Location Room 701-702, Dihao Building, Pearl River Plaza, Haikou City, Hainan Province, China

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