Metal Bonded Abrasives
Edge Grinding Diamond Wheels Diamond Grinding Disc For ITO Glass
Edge Grinding Diamond Wheels Diamond Grinding Disc For ITO Glass Diamond Wheels for Edge-Grinding Main features: High consistency of slots and good interchangeability. High process precision. Good sharpness, long life span and low noise. Good product verticality and strict dimension requirement without surface and angle chipping. Application: Mainly used for edge grinding various kinds of glass such as ITO glass, PDP glass, quartz glass, microcrystalline glass, photovoltaic
Diamond Dressing Roller Metal Bonded Abrasives For High Precision Form Grinding
Diamond Dressing Rollers for High Precision Form Grinding Product overview We can produce high precision dressing rollers with inner galvanizing (UZ) methods. For example, we can supply complica-ted multi-teeth rollers with small radius R0.1 and teeth distance less than 1mm and heavy grinding rollers with height more than 200mm and height diameter ratio bigger than 1.5. Our dressing rollers produced with outer galvanizing methods are used for dressing vitrified CBN grinding
Diamond Cutting Blade Angle Grinder Diamond Blade OHSAS Approval
Diamond blade are used to remove the head and tail of the sapphire crystal or to make the square Main features Thin thickness, small slits-high raw material utilization, less waste; High sharpness and high precision-good surface quality of the cutting workpiece; Long lifespan and stability-reduce processing costs Specification: Universally specification(mm) M1A1R 200D*1.2T*31.75H*1E*5X M1A1R 200D*1.5T*31.75H*1.2E*5X M1A1R 300D*1.5T*31.75H*1.2E*5X M1A1R 350D*2.0T*31.75H*1.8E
LED Substrate Grinding Wheels Metal Bonded Abrasives ISO14001
Grinding Wheels for LED Substrate Application The grinding wheels for LED substrate are mainly used for back thinning of 2”, 4” and 6”LED epitaxial wafers. They can be used steadily on the Japanese, Korean and Taiwanese grinders with high performance. Workpiece: sapphire epitaxial wafer, SiC substrate epitaxial wafer, Si substrate epitaxial wafer. Material of workpiece: Synthetic sapphire, SiC ,single crystal silicon. Grinders: WEC , GALAXY ,SPEEDFAM , NTS , SHUWA , OKAMOTO.
Diamond Dicing Blades Metal Bonded Abrasives Dicing Saw Blade
Diamond Dicing Blades Metal Bonded Abrasives Dicing Saw Blade Product overview Metal bond dicing blades are made of identical material,with thin thickness and high precision, they are mainly used for grooving and cutting with high accuracy and narrow cutting depth. Specification 1A8/1 type, without water slot. 1A8/2 type, with water slot. Main features The grits are strongly held by the metal bond, high precision, minimized blade wear, good shape keeping ability and long life
2in 4in 6in 8in Diamond Core Drill Metal Bonded Abrasives ISO9001
Diamond core drill Diamond core drill is used to core the sapphire crystal. According to the specification of sapphire ingots, the high precision core drills are generally divided into 2in, 4in, 6in, 8in and various non-standard sizes. The effective drilling depth is generally 150mm~300mm. Main features Sharpness-no fish scales, cracks, etc. High precision-outer circle run-out
Ceramic Honing Sticks Metal Bonded Abrasives For Refrigeration Bearing
Ceramic Honing Sticks Metal Bonded Abrasives For Refrigeration Bearing Main features High efficiency High precision Low power consumption Application They are used for processing different materials (various cast iron, ceramic, aluminum alloy and plated chrome) cylinder sleeve, cylinder block and connecting rods. They are widely used for automotive, motorcycle, refrigeration, bearing, marine, and aviation etc. The specifications include HMA/1,HMA/2,HMH,2HMA,HMA/S0,HA, HH. We