Resin Bond Dicing Blades

Product overview

Resin bond dicing blades without steel core is mainly used for precision cutting and slotting for semiconductor, optical glass, quartz glass,ceramics and so on.

Main features

Sharpness cutting and elastic bond can improve the surface quality.

High precision, less dressing or no need to dress.

Widely used, variety specifications, short delivery time.

Application

ZS001 series is suitable for semiconductor components(KFN,DFN), which can avoid burrs, and improve efficiency and life.

ZS002 series is suitable for optical glass, which can avoid chip and improve yield.

ZS003 series is suitable for quartz glass, which can avoid chips and improve efficiency, and finish of product.

ZS004 series is suitable for ceramics, which can avoid chips and cracks, and improve the processing quality.

Other series are suitable for slotting and cutting of crystal, magnetic materials, carbide and some other difficult to cut metal materials with excellent cutting quality.