China Abrasives Industry Hainan Corporation
                                                                                                           
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38 Years
Since 1988
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Diamond Grinder Blade Resin Bond Abrasives For Sapphire Ingot

Price Negotiable
Price: USD 1 for one piece
MOQ: One piece
Delivery Time: 7-10 days
Brand: CAEC
Product Description

Diamond Grinder Blade Resin Bond Abrasives For Sapphire Ingot

 

Diamond grinding wheel is used to process and trim the external circle of the sapphire ingot to obtain precise external circle dimensional accuracy and edge shape and the oriented-side plane(OF plane) of sapphire ingot by grinding the reference edge.

 

 

Main features

High sharpness---high processing efficiency for hard and brittle materials such as sapphire.

Good elasticity---have a polishing effect, good surface quality of the workpiece.

Stable quality---uniform consumption in use and long service life.

 

 

Specification :

Universally specification

Bond

Type

Specification

Resin bond

 

1A1

14A1

200D-20T-20H-5W

250D-25T-76H-5W

300D-20T-127/203H-5W

300D-40T-127/203H -5W

350D-40T-127/203H -5W

400D-40T-127/203H -5W

Metal bond

 

  66D-8W-56L
Note: the wheel specification can be produced according to customer’s requirement.

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company China Abrasives Industry Hainan Corporation
Location Room 701-702, Dihao Building, Pearl River Plaza, Haikou City, Hainan Province, China

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