Curved 1500C 95 Alumina Ceramic Alumina Ceramic Substrate For Insulation Heat Resistance
Curved 95% Alumina Ceramic Substrate For Insulation And Heat Resistance
Alumina ceramic substrate is widely used in many fields. Because of its great performance, it is more and more used in curent society, alumina ceramic substrate can meet the requirement of daily using and specifical features.
95% Alumina Ceramic is commonly used in the electronics industry like thick film circuits, large-scale integrated circuits, hybrid ICs, semiconductor packages, chip resistors, network resistors, focus potentiometers, etc., it is most frequently used ceramic substrates because of its excellent advantages:
Features
✔High mechanical strength and hardness
✔Good electrical insulation
✔Low dielectric constant and dielectric loss
✔Similar thermal expansion with Si
✔High thermal conductivity
✔Excellent corrosion resistance
✔Non-toxic
✔Available for surface metalization
| Properties | Unit | Steatite ceramic | 95% Al2O3 | 99% Al2O3 | Zirconia Ceramic |
| Density | g/cm³ | 2.8 | 3.6 | 3.8 | 5.6 |
| Flexural strength | Mpa | 145 | 300 | 300 | 354 |
| Max Working Temperature | ℃ | 1100 | 1400 | 1600 | 1400 |
| Sintering temperature | ℃ | 1350 | 1700 | 1750 | 1550 |
| Heat resistance | T(℃) | 200 | 220 | 200 | 350 |
| Hardness | Gpa | 5.7 | 7 | 10.7 | 12.3 |
| Elastic modulus | Gpa | 120 | 275 | 320 | 205 |
| Poissons ratio | - | 0.21 | 0.22 | 0.22 | 0.30 |
| Linear expansion coefficient | x 10-6/℃ | 7.9 | 7.1 | 7.8 | 9 |
| Insulation breakdown Intensity | KT/mm | 10 | 16 | 18 | 15 |
| Thermal conductivity | w/(m.k) | 2.5 | 20 | 25 | 2.5 |
| Specific Heat | *10-3J/(kg*K) | 0.75 | 0.78 | 0.78 | 0.4 |
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