Shenzhen Sky-Win Technology Co., Ltd
                                                                                                           
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0.2mm Min. Trace Spacing FR4 Green Solder mask Communication Printed Circuit Board Assembly for ROHS System

Price Negotiable
Price: Negotiation
MOQ: 10
Delivery Time: 5-10 working days
Brand: Sky-Win Technology
Product Description

0.2mm Min. Trace Spacing FR4 Green Solder mask Communication Printed Circuit Board Assembly for ROHS System

 
Project Summary for Network Communications Client

A client from the network communications sector required a specialized collaborator, known for their expertise and comprehensive capabilities, to assemble their printed circuit board (PCB) with meticulous attention to detail. The project called for precision and sophistication in assembly processes.

Advanced Assembly Techniques

The PCB assembly was executed with cutting-edge automatic insertion machinery complemented by meticulous hand insertion methods. Precision was paramount, and each component was placed with exacting accuracy. To further ensure the integrity of the connections, hand soldering techniques were utilized with strict adherence to a lead-free solder standard.

Materials and Specifications

Constructed from high-quality FR4 material, the board was designed to handle complex configurations. It boasted a total of 729 component placements, achieved through the use of sophisticated surface mount and through-hole mounting technologies. In terms of complexity, the multilayer board consisted of 8 distinct layers and was compatible with a variety of package sizes, including 0603. It also accommodated fine-pitch spacing that met the requirements of specified LGA, BGA, and QFN packages.

Quality Assurance and Turnaround

To guarantee the product met the highest quality standards, rigorous quality control measures were in place, including automated optical inspection (AOI) and comprehensive functionality testing. This thorough approach was not just about adhering to standards, it was about surpassing client expectations. Despite the complexity, the project was completed within an impressive 4 to 6-week timeframe.

 
5G Communication: The Revolution of PCB Manufacturing & Assembly

Printed Circuit Boards (PCBs) stand as the cornerstone of modern communication devices, incorporating meticulously crafted multilayer High-Density Interconnect (HDI) boards. The dawn of the 5G era beckons a surge in demand for PCBs that exemplify exceptional stability, adaptability, and user-friendliness during both manufacturing and assembly processes.

Skywin positions itself at the forefront of this technological evolution, offering expeditious, turnkey solutions for PCB manufacturing and assembly. Our services extend to an array of communication tools, including base station apparatus, wireless machinery, and handheld digital devices, among others.

Our dedication to excellence is showcased in the 5G smartphones that we have crafted for our clientele. These devices are composed of Class-A substrates and utilize purely original components. They are constructed following the RoHS & REACH regulations, attesting to our commitment to sustainability and consumer safety.

In their quest for compliance with the stringent standards set by local telecommunications entities, our products have undergone rigorous inspections, triumphantly securing expedited market entry. This pivotal step has catalyzed a marked uptick in sales, as recognition of product quality resonates with a growing consumer base.

 

Specifications for 5G Telephone Application

 

Assembly Process Double-sided Mounting
Surface HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect.
Copper thickness 0.25 Oz -12 Oz
Material FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers
Board thickness 0.1 to 6.0mm(4 to 240mil)
Minimum line width/space 0.076/0.076mm
Minimum line gap +/-10%
Outer layer copper thickness 140um(bulk) 210um(pcb prototype)
Inner layer copper thickness 70um(bulk) 150um(pcb protytype)
Min.finished hole size(Mechanical) 0.15mm
Min.finished hole size (laser hole) 0.1mm
Aspect ratio 10:01(bulk) 13:01(pcb prototype)
Solder Mask Color Green,Blue,Black,White,Yellow,Red,Grey
Tolerance of dimension size +/-0.1mm
Tolerance of board thickness <1.0mm +/-0.1mm
Tolerance of finished NPTH hole size +/-0.05mm
Tolerance of finished PTH hole size +/-0.076mm
Delivery time Mass:10~12d/ Sample:5~7D

 

FAQ:

Q1: What is the brand name of the Communication PCB Assembly product?

A1: The brand name of the product is Sky-Win Technology.

Q2: Can you provide the model number for the Communication PCB Assembly?

A2: Yes, the model number is SMT-PCBA-050.

Q3: Where is the Communication PCB Assembly manufactured?

A3: The Communication PCB Assembly is manufactured in Shenzhen, China.

Q4: What certifications does the Communication PCB Assembly have?

A4: The Communication PCB Assembly is certified with IATF16949.

Q5: What is the minimum order quantity for the Communication PCB Assembly?

A5: The minimum order quantity for the Communication PCB Assembly is 10 units.

Q6: How is the Communication PCB Assembly priced?

A6: The price of the Communication PCB Assembly is subject to negotiation.

Q7: What are the packaging details for the Communication PCB Assembly?

A7: The Communication PCB Assembly is packaged in cartons.

Q8: What is the delivery time for the Communication PCB Assembly?

A8: The delivery time for the Communication PCB Assembly is 5-10 working days.

Q9: What are the payment terms for the Communication PCB Assembly?

A9: The payment terms for the Communication PCB Assembly are L/C, D/A, D/P, T/T.

Q10: What is the supply ability for the Communication PCB Assembly?

A10: The supply ability for the Communication PCB Assembly is 100,000 pcs.

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Sky-Win Technology Co., Ltd
Location 4F&2F, Building 1st, Nanchang Huafeng Industrial Park,NanchangCommunity, Xixiang Town, Baoan District, Shenzhen, China
Contact Person Yang

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