GT SMART (Changsha) Technology Co., Limited
                                                                                                           
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Rigid High Density Interconnect Boards 4L / HDI Multilayer PCB

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Brand: Customized
Product Description

4L_Rigid_0.30mm_KB6160A+ENIG 1.6MM+/-10% 5.33:1 2/3/3/2 OZ

 

HDI PCBs have been used in a variety of applications, ranging from mobile phones and other consumer electronics to industrial and aerospace equipment. The increased circuit density of HDI PCBs makes them an attractive option for designers looking to reduce the overall size of their electronics products. In addition, the increased circuit density also allows for improved signal integrity and faster transmission speeds.

 

Layer count: 4
Copper thickness: 2/3/3/2 OZ
Board thickness: 1.6MM+/-10%
Min hole size: 0.30mm
Aspect ratio: 5.33:1
Board edge plating: NO
Material: KB6160A
Surface treatment: ENIG
Profile: 233.3*109.09MM

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company GT SMART (Changsha) Technology Co., Limited
Location Room 401,No.5 Building, Dingfeng Technology Park, Shayi Community, Shajing Town, Bao'an District,Shenzhen,Guangdong Province,China
Contact Person Alice

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