Product Description:

The HDI PCB is a high density interconnect printed circuit board designed to meet the demanding requirements of modern electronic applications. With its advanced manufacturing techniques and superior material choices, this product ensures exceptional performance, reliability, and precision in complex circuit designs. The HDI PCB features an impressive minimum line space of 0.075mm, allowing for extremely fine circuit patterns that support miniaturization and high functionality in compact spaces. This capability makes it an ideal solution for cutting-edge electronics where space savings and high circuit density are critical.

HDI PCB Design DFM Requirements

Normally, DFM requirements relating to clearances in HDI PCB are quite strict,  but it can be come tured by taking advantage of your design rules in your PCB design software. Some of the important DFM requirements to gather before layout and routing include:

• Circuit width and spacing limits
• Annular ring and aspect ratio limits, especially for high reliability designs and requirements
• Material choice used in the board to ensure impedance control in the required stackup
• Impedance profiles for the desired stackup or layer pairs if available 
• Blind vias connect  exterior layer to at least one interior layer without penetrating the entire board.
• Buried vias connect one or more inner layers together without any connections to the exterior layers of a board.
• Any layer HDI refers to the use of stacked copper-filled microvias to connect multiple layers in a PCB.