Using high-quality abrasives such as alumina, silicon carbide, and ceramic particles, combined with 3M's patented electrostatic sand planting process, the sand particles are oriented and arranged, cutting is sharp and uniform, and the polishing efficiency is increased by 30% -50% compared to ordinary sandpaper, greatly reducing working hours.

The special resin adhesive is combined with high-strength substrates (paper/film/fabric), which are tear resistant, block resistant, and less prone to sanding after repeated use. Single sandpaper has a longer service life and lower overall cost.

Material coverage: metal (stainless steel/aluminum alloy), wood, paint surface, plastic, composite materials, and other materials that are universally applicable;

Rich particle size: P40-P2000 multi-level particle size options (coarse grinding to fine polishing), meeting the full process requirements from rough machining to fine polishing;

Diverse substrates: dry/wet sandpaper, back velvet sand disc, self-adhesive sandpaper, etc., suitable for various operation methods such as manual polishing and mechanical polishing.