HanWei Expanded the Processing Capabilities for Semiconductor Laser Welding Head
The semiconductor laser welding head is intended for applications where a semiconductor laser is used as the energy source for joining materials. It can be applied to medium-thickness plate welding, welding of large products, soldering, and plastic welding. These applications give the welding head a broad role in different types of manufacturing and assembly work.
For laser equipment manufacturers and end users, the choice of welding head can affect the overall configuration and investment of a system. This product is positioned as an economical and efficient option for semiconductor laser welding. It focuses on the requirements of practical welding applications, providing a suitable component for systems where performance and equipment cost both need to be considered.
Key Features
- Expanding the Processing Possibilities of Semiconductor Lasers.
- Completely Enclosed Internal Construction.
- Cooling Arranged Within the Product.
- A Power Range Covering 30W to 4000W.
- Three Ways to Match the Laser Source.
- A Straightforward Choice for Cost-Effective Welding.
| Model |
HW-36-XXXXXX-T-QBH |
HW-50-XXXXXX-F-QBH |
|---|---|---|
| Usable Power |
200 W maximum |
500-4000 W maximum |
|
Collimating length |
80/100/120/150/200 |
100 / 150 / Customized |
|
Focus length |
80/100/120/150/200 |
80/100/120/150/200 |
| Interface type |
SMA 905 / D80 |
SMA 905 / QBH |
| Accessible wave range | 1064 | 1064 |
| Head Type |
F / T / Y |
F / T / Y |
| Net Weight |
1.1 kg |
2.7 kg |
|
Usable laser source |
Diode laser source |
Diode laser source |
The welding head incorporates a water circuit as part of its construction, with the cooling arrangement covering the 30W-4000W laser power range. Integrating the water path into the welding head provides a dedicated cooling configuration for the corresponding semiconductor laser system.
Another characteristic of the product is its fully enclosed internal structure. The internal components are contained within the closed construction rather than being exposed. This structural approach, together with the integrated water circuit, forms the main design of the welding head for semiconductor laser applications.
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