SALMUT Ceramic Material High Thermal Conductivity Silicon Nitride AMB Copper Clad Sheet

High thermal conductivity silicon nitride AMB Copper Clad Sheet

Silicon nitride ceramic is an inorganic material ceramic that does not shrink during sintering. Silicon nitride has high strength, especially hot pressed silicon nitride, which is one of the hardest substances in the world. It has properties such as high strength, low density, and high temperature resistance.

Characteristic

Thermal shock: -50 to 175 degrees Celsius, hot and cold 3000 cycles of impact;

Void rate: below 1%;

Lithography graphics: The graphic size is customized according to customer requirements

Protective layer: Production of protective layer by electroplating or chemical plating according to customer requirements