Shenzhen Hiner Technology Co.,LTD.
                                                                                                           
Verified Supplier
13 Years
Since 2013
Menu
Packaging & Printing Logistics Packaging Protective & Cushioning Material

Wafer Foam Of Different Thicknesses Is Used In Wafer Carrier To Cushion And Protect Wafer

Price Negotiable
Price: Prices vary with delivery methods and quantities
MOQ: 500PCS(Negotiable)
Delivery Time: 1~2 Weeks
Brand: Hiner-pack
Product Description

Wafer Foam Of Different Thicknesses Is Used In Wafer Carrier To Cushion And Protect Wafer
Product Description:

 wafer foam separator is a specialized component used in the semiconductor manufacturing process, particularly in the handling and packaging of wafers. Here are some key points about it:

Purpose: The primary function of a wafer foam separator is to protect wafers from physical damage and contamination during transport and storage. It provides cushioning and prevents direct contact betweenwafers.

 

Material: Typically made from soft, flexible foam materials, these separators can absorb shocks and vibrations, which helps in maintaining the integrity of delicate silicon wafers.

 

Design: The separators are designed to fit between individual wafers, often with cutouts or grooves that accommodate the specific dimensions of the wafers, ensuring a snug fit.

 

Applications: Wafer foam separators are commonly used in various stages of semiconductor fabrication, including during the transport between different processing steps, as well as in storage and shipping containers.

 

Benefits: Using wafer foam separators reduces the risk of scratches, chips, and other types of damage that can occur during handling, ultimately improving yield and reliability in semiconductor products.

Overall, wafer foam separators play a crucial role in ensuring the safe handling of semiconductor wafers throughout the manufacturing process.

Parameter

Value

Material

Antistatic Polyethylene

Origin

China

Breathability

High

Durability

High

Property

Avoid Corrosion

Property*2

Good Shock Resistance

Surface Resistance*1

1.0*10E4~1.0*10E11Ω

Shape

Round

Size

4~12 Inch/100~300mm

Property*1

No Organic Pollution

Key Features
Description
Color
Pink
Placement
Horizontally In The Wafer Shipper
Shock Absorption
Provides cushioning and protection against shocks

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co.,LTD.
Location Building A11,Zone D,West Industrial Zone,Minzhu Community, Shajing Street,Baoan District,Shenzhen City,GD Province CN
Contact Person Rainbow

Request A Quote

Please check your email address.
Your message must be at least 20 characters.