Precision micro‑hole component for **optical modules, MEMS devices, fiber coupling bases and hermetic opto‑packaging**

1.Application

Precision micro‑hole component for optical modules, MEMS devices, fiber coupling bases and hermetic opto‑packaging. 0.3 mm fine aperture for fiber positioning, optical path transmission and venting. Ensure optical alignment and hermetic sealing, widely used in data‑center optical transceivers.

2.Material & Performance

Kovar alloy (Fe‑Ni‑Co). Thermal expansion matches glass & ceramic for reliable glass‑to‑metal hermetic sealing. Good weldability and thermal dimensional stability. Aperture dimension stable under temperature cycling. RoHS compliant.

3.Processing

Precision CNC machining + laser micro‑drilling. Machine profile & mounting holes; laser drill Φ0.3 mm fine hole. Full deburring, no burr or chipping on hole inner wall. Control thin‑part distortion.

4.Accuracy & Requirement

Tolerance ±0.01 mm; micro‑hole Φ0.3±0.005 mm; hole position tolerance ≤0.01 mm; Ra≤0.8 μm. Operating temp‑40℃~+125℃. Protect micro‑hole against impact and blockage; assemble without squeezing; keep dust‑free environment.

5.Heat Treatment

Stress‑relief annealing, release machining stress, stabilize micro‑hole dimension, prevent aperture shift under thermal cycling.

6.Post‑treatment

Degreasing & ultra‑sonic cleaning; gold / nickel plating optional for solderability & anti‑corrosion.

7.Quality Control

ISO9001 system. Spectroscopic material verification; microscope inspection for micro‑hole quality; CMM full dimension test; particle‑controlled cleaning.Industrial Packaging: Individual clean vacuum PE bag, anti‑static box. Moisture‑proof vacuum tray packing for bulk orders, prevent micro‑hole clogging.