AI+ Intelligent Busway System with Low Temperature Rise ≤ 30K and Molecular-Shield Solid Insulation for AI Data Centers

CESKO AI+ Intelligent Busway System with Low Temperature Rise for Long-Duration Full-Load Operation

Heat is the hidden enemy of high-density AI power distribution. This AI+ intelligent busway achieves a temperature rise of no more than 30K at full load thanks to Molecular-Shield insulation with a continuous heat-dissipation path, supporting sustained 100kW-class rack operation without connection overheating.

• 30K Full-Load Temperature Rise: Verified low temperature rise protects joints and connections during continuous high-current AI operation.
• Continuous Heat Path: Integral molded insulation improves heat dissipation compared with wrapped film designs.
• Connection Risk Reduction: Lower thermal stress slows oxidation and loosening at tap-off and joint points.
• Long-Term Reliability: Stable thermal performance extends service life and reduces unplanned maintenance.

• AI data centers and AI computing power centers
• GPU clusters and HPC computing halls
• 100kW-class high-density server racks
• UPS output to high-density rack row power distribution

Manufactured under ISO 9001 quality management with UL/IEC/CNAS/CMA certified testing. Intelligent busway system delivered with monitoring platform access, installation guidance and technical documentation. OEM and ODM support available.