Precision Grinding Alumina Ceramic Grinding Balls with Thermal Conductivity 20 W/mK Low Water Absorption ≤0.01% and Flexural Strength 40MPa

Product Description:

Features:

Adopting HUAO exclusive isostatic pressing process, the roundness error of the sphere is ≤± 0.05mm, the surface roughness Ra is ≤ 0.4 μ m, ensuring uniform force during precision grinding; Using 92% high-purity alumina substrate and adding 3% composite reinforcing agent, after gradient sintering at 1650 ℃, the flexural strength reaches 40MPa, and there are no cracks in the 1.5m drop ball impact, far exceeding the industry's impact resistance standard. Third party testing shows that after continuous precision grinding of electronic ceramic powder for 30 days, the wear rate is only 0.04%, and the grinding amount per unit time is 25% higher than that of ordinary grinding balls, achieving a breakthrough in both accuracy and efficiency.

Technical Parameters:

Applications:

 In the field of electronic ceramics, 10-15mm specifications are suitable for precision grinding of MLCC ceramic powder, with a particle size control accuracy of D50 ± 0.2 μ m; In the field of precision metallurgy, the 20-25mm specification is used for grinding tungsten molybdenum powder, with high roundness ensuring uniform powder particle size; In the field of optical glass, the 15-20mm specification is used to process glass substrates with low roughness to avoid scratching the substrate; In the field of pharmaceutical powders, the specifications of 8-12mm comply with GMP standards, and precision grinding ensures the purity and particle size consistency of powders.

Support and Services:

HUAO provides full process precision grinding services. Pre sales customized grinding solutions are provided based on material accuracy requirements and equipment parameters. Free samples are provided for small-scale testing, and precision and efficiency testing reports are issued.