Product Description:

But our ceramic heat sink is not just efficient, it's also durable, with a long life span that ensures it can withstand even the most demanding of environments. With a mechanical strength of ≥3000MPa, it can handle the stresses of high-powered devices without cracking or breaking.

Our ceramic heat sink is also designed with surface roughness in mind, with a range of 0.3-0.8 Um, ensuring smooth airflow over the surface of the heat sink, improving heat dissipation and reducing the risk of hotspots.

But what really sets our ceramic heat sink apart is its high breakdown voltage and resistance, making it the perfect choice for devices that require reliable and long-lasting heat dissipation. Whether you're working with high-powered LEDs, power supplies, or other electronic devices, our ceramic heat sink is the best choice for ensuring the safe and efficient operation of your equipment.

So if you're looking for a long-lasting, high-performance heat sink that won't let you down, look no further than our Ceramic Heat Sink product. With its superior density, mechanical strength, surface roughness, and resistance, it's the ideal choice for any device that requires efficient heat dissipation in limited space.

Features:

• Product Name: Ceramic Heat Sink
• Temperature Resistance: ＜700℃
• Surface Roughness: 0.3-0.8 Um
• Density: 3.7g/cm^3
• Material: Ceramic, SiC, Al₂O₃, SiO₂, Al₄C₃
• Mechanical Strength: ≥3000MPa
• Low cost
• Not affected by humidity and dust
• No antennae effect

Technical Parameters:

Applications:

The Ceramic Heat Sink/Ceramic Micro Porous Heat Sink has a large surface area compared to Aluminium Heat Sinks, resulting in better heat dissipation. Its lightweight design makes it easy to install and handle. With a temperature resistance of less than 700℃ and a density of 3.7g/cm^3, this product is ideal for applications that require high-temperature resistance and high-density power.

This product can be used with various electronic devices such as Transistors, MOSFETs, Schottky Diodes, IGBTs, high-density switching power supplies, high-frequency communication signal equipment, high-frequency welding machines, and other electronic devices. Its power dissipation of up to 10W makes it suitable for high-performance applications.

At Race, we offer packaging options as per customer requirements and a delivery time of 7-15 days. Payment terms are 30% TT in advance, and the balance payment is paid before shipment. The Ceramic Heat Sink/Ceramic Micro Porous Heat Sink is available in green, black, white, and gray colors, giving our customers the opportunity to choose the color that best suits their device.