ZSUN CHIPS CO., LTD
                                                                                                           
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China Laird Tflex SF10 Thermal Gap Filler Pads - 10 W/mK Thermal Conductivity Grey Silicone Material for sale
China Laird Tflex SF10 Thermal Gap Filler Pads - 10 W/mK Thermal Conductivity Grey Silicone Material for sale
China Laird Tflex SF10 Thermal Gap Filler Pads - 10 W/mK Thermal Conductivity Grey Silicone Material for sale

Laird Tflex SF10 Thermal Gap Filler Pads - 10 W/mK Thermal Conductivity Grey Silicone Material

Price Negotiable
Price: Negotiable
MOQ: 100pcs
Delivery Time: 7-15 working days
Brand: Laird
Product Description
Laird Tflex SF10 Thermal Gap Filler Pads
Premium thermally conductive gap filler material with 10 W/mK thermal conductivity, designed for efficient heat dissipation in electronic applications.
Product Overview
These grey thermally conductive gap filler pads provide superior thermal management solutions for electronic components. The Laird Tflex SF10 material offers excellent thermal conductivity while maintaining flexibility and ease of application.
Key Specifications
Property Value
Thermal Conductivity 10 W/mK
Material Type Silicone-based Gap Filler
Color Grey
Manufacturer Laird Tflex SF10 Series
Processing Method Die Cutting Available
Key Features
  • High thermal conductivity of 10 W/mK for efficient heat transfer
  • Flexible silicone-based material conforms to irregular surfaces
  • Excellent gap-filling capabilities for thermal interface applications
  • Available in die-cut forms for precise component fitting
  • Reliable performance across wide temperature ranges
  • Easy to apply and remove for maintenance purposes
Applications
Ideal for thermal management in electronic devices including power supplies, LED lighting, automotive electronics, telecommunications equipment, and industrial control systems where efficient heat dissipation is critical.
Product Images
Laird Tflex SF10 thermal gap filler pad showing material texture and application
Close-up view of thermally conductive gap filler pad material structure
Customization Options
Available in various thicknesses and can be custom die-cut to match specific component shapes and sizes, ensuring optimal thermal contact and performance in your electronic assemblies.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company ZSUN CHIPS CO., LTD
Location D202-A208, Building D, Guanghong Meiju, No. 163, Pingxin North Road, Hehua Community, Pinghu Street, Longgang District, Shenzhen, Guangdong, China
Contact Person Rose Luo

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