ZSUN CHIPS CO., LTD
                                                                                                           
Verified Supplier
5 Years
Since 2021
Menu
Menu
Home
Products
Show All Products
Power Inductors
Thermal Interface Materials
FPGA IC
Board to Board Connectors
IC Chips
Common Mode Chokes
Ferrite Core Ring
FPC Connectors
USB Connectors
EMC Components
Electronic Components Connectors
EMC Materials
EMI EMC Testing
Videos
About Us
Contact Us
Consumer Electronic Computer Hardware & Software Laptop Cooling Pads
China Tflex SF10 Silicone-Free Thermal Gap Filler Pad 10 W/mK for Automotive & Industrial Electronics for sale
China Tflex SF10 Silicone-Free Thermal Gap Filler Pad 10 W/mK for Automotive & Industrial Electronics for sale
China Tflex SF10 Silicone-Free Thermal Gap Filler Pad 10 W/mK for Automotive & Industrial Electronics for sale

Tflex SF10 Silicone-Free Thermal Gap Filler Pad 10 W/mK for Automotive & Industrial Electronics

Price Negotiable
Price: Customize
MOQ: 1000pcs
Delivery Time: 1-3 weeks
Brand: Laird
Product Description
Tflex SF10 silicone-free thermal gap filler pad with 10 W/mK thermal conductivity
Product Overview
Tflex SF10 is an innovative high-performance thermal gap filler material from Laird's portfolio. This silicone-free thermal interface material delivers 10 W/mK thermal conductivity with excellent deflection properties that minimize pressure on components. Very little pressure is required to achieve the lowest possible thermal resistance.
Key Features & Benefits
  • Silicone-free formulation for enhanced reliability
  • Low Shore Hardness for superior conformability
  • Low pressure versus deflection characteristics
  • Minimizes board and component stress during installation
  • No fiberglass reinforcement for improved performance
  • Environmentally friendly solution compliant with RoHS and REACH regulations
Technical Specifications
Thermal Conductivity 10 W/mK
Material Type Silicone-Free Thermal Gap Filler
Product Series Tflex SF10
Manufacturer Laird
Target Industries
Automotive, Consumer Electronics, Industrial Equipment, Telecom/Datacom, Aerospace/Defense
Primary Applications
Automotive Electronics, ADAS Systems, Powertrain/ECUs, Infotainment Systems, Routers, Hard Disk Drives, Solid State Drives, Wireless Infrastructure, Drones/Satellites, Gaming Systems, Smart Home Devices, Notebooks/Tablets/Portable Devices
ZSUN TECH thermal interface materials and electronic components applications
About ZSUN TECH
ZSUN TECH is an advanced enterprise specializing in research, development, production, and sales of EMC components, connectors, cables, and integrated circuits. With a professional team averaging over 10 years of expertise in electronic components, we provide comprehensive EMC solutions including component selection, simulation, training, and corrective testing services.
Contact Information
Sales Manager: Rose
Email: Rose@zsun-chips.com
Similar Products
China SPI09 Series Shielded Power Inductor 8.4x7.9x7.2mm to 12.1x11.4x9.5mm SMT Package with 27A Current Rating for sale

SPI09 Series Shielded Power Inductor 8.4x7.9x7.2mm to 12.1x11.4x9.5mm SMT Package with 27A Current Rating
China DCCM17 Series Flat Wire DC Common Mode Choke SMD Inductor 5.6A 500Ω 6.3×5×5mm Line Filter for sale

DCCM17 Series Flat Wire DC Common Mode Choke SMD Inductor 5.6A 500Ω 6.3×5×5mm Line Filter
China XC6SLX16-2FTG256C Spartan-6 FPGA IC Chip with 667 MHz Clock Speed and 256-Pin BGA Package for sale

XC6SLX16-2FTG256C Spartan-6 FPGA IC Chip with 667 MHz Clock Speed and 256-Pin BGA Package
China 10M50DAF256C7G FPGA IC with 178 I/O Interfaces in 256FBGA Package -40°C to 125°C Operating Temperature for sale

10M50DAF256C7G FPGA IC with 178 I/O Interfaces in 256FBGA Package -40°C to 125°C Operating Temperature
China Tflex HD90000 Thermal Pad - 7.5 W/mK High Conductivity Gap Filler for Electronics (0.040

Tflex HD90000 Thermal Pad - 7.5 W/mK High Conductivity Gap Filler for Electronics (0.040" to 0.200" Thickness)
China Laird Tflex SF10 Thermal Gap Filler Pads - 10 W/mK Thermal Conductivity Grey Silicone Material for sale

Laird Tflex SF10 Thermal Gap Filler Pads - 10 W/mK Thermal Conductivity Grey Silicone Material
China 50V Board to Board Pin Connector SMT Type 0.5mm Pitch with 2.0mm-15mm Height Range for High-Density PCB Applications for sale

50V Board to Board Pin Connector SMT Type 0.5mm Pitch with 2.0mm-15mm Height Range for High-Density PCB Applications
China ADM7150ACPZ-3.3-R2 3.3V 800mA Linear Voltage Regulator in 8-LFCSP Package for Industrial Applications for sale

ADM7150ACPZ-3.3-R2 3.3V 800mA Linear Voltage Regulator in 8-LFCSP Package for Industrial Applications
China HMC345ALP3E SP4T RF Switch 8GHz 16QFN for Non-Isolated PoL Module Applications for sale

HMC345ALP3E SP4T RF Switch 8GHz 16QFN for Non-Isolated PoL Module Applications
China SMPS Common Mode Choke ACCM04 Series MnZn Inductor 23.3x18.5x11.5mm SMT Power Filter Component for sale

SMPS Common Mode Choke ACCM04 Series MnZn Inductor 23.3x18.5x11.5mm SMT Power Filter Component
China Black PCB Board-to-Board Connector 0.4mm Pitch 0.8mm Height with 30+ Position Options for sale

Black PCB Board-to-Board Connector 0.4mm Pitch 0.8mm Height with 30+ Position Options
China XC7Z010-1CLG400C SoC with Dual ARM Cortex-A9 667MHz and 28K FPGA Logic Cells in 400-CSPBGA Package for sale

XC7Z010-1CLG400C SoC with Dual ARM Cortex-A9 667MHz and 28K FPGA Logic Cells in 400-CSPBGA Package

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company ZSUN CHIPS CO., LTD
Location D202-A208, Building D, Guanghong Meiju, No. 163, Pingxin North Road, Hehua Community, Pinghu Street, Longgang District, Shenzhen, Guangdong, China
Contact Person Rose Luo

Request A Quote

Please check your email address.
Your message must be at least 20 characters.