Tflex HD90000 Thermal Pad - 7.5 W/mK High Conductivity Gap Filler for Electronics (0.040" to 0.200" Thickness)
Tflex HD90000 thermal interface pads deliver exceptional 7.5 W/mK thermal conductivity combined with superior pressure versus deflection characteristics. This advanced material minimizes stress on electronic components while providing low thermal resistance, reducing both mechanical and thermal stresses within your devices.
| Thermal Conductivity | 7.5 W/mK |
| Thickness Range | 0.040" (1000 µm) to 0.200" (5000 µm) |
| D3-D20 Outgassing | < 20ppm |
- Low pressure versus deflection for minimal component stress
- Excellent surface wetting for low contact resistance
- Minimizes board and component stress during operation
- Low outgassing performance for sensitive applications
- Environmentally compliant with RoHS and REACH requirements
- Ideal for large tolerance applications
Automotive, Consumer Electronics, Industrial Equipment, Telecom/Datacom, Aerospace/Defense
- Automotive Electronics & ADAS Systems
- Automotive Powertrain & ECUs
- Automotive Infotainment Systems
- Routers & Wireless Infrastructure
- Hard Disk Drives & Solid State Drives
- Drones, Satellites & Aerospace Systems
- Gaming Systems & Smart Home Devices
- Notebooks, Tablets & Portable Devices
ZSUN TECH is an advanced enterprise with over 10 years of expertise in electronic components, specializing in EMC components, connectors, cables, and integrated circuits. Our professional team provides comprehensive EMC solutions including component selection, simulation, training, and corrective testing services.
Sales Manager: Rose
Email: Rose@zsun-chips.com
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.