ZSUN CHIPS CO., LTD
                                                                                                           
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5 Years
Since 2021
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Tflex HD700 Thermal Gap Filler Pad 5.0 W/mK Thermal Conductivity 0.5mm to 5mm Thickness

Price Negotiable
Price: Customize
MOQ: 1000pcs
Delivery Time: 1-3 weeks
Brand: Laird
Product Description
Tflex HD700 Thermal Gap Filler Overview
Tflex™ HD700 thermal gap filler combines 5 W/mK thermal conductivity with superior pressure versus deflection characteristics. This combination allows minimal stress on components while yielding low thermal resistance, resulting in reduced mechanical and thermal stresses within your device.
Key Technical Specifications
Property Value
Thermal Conductivity 5.0 W/mK
Available Thickness 0.5mm (0.020") to 5mm (0.200")
Standard Color Light Pink
Alternative Color Grey (Tflex HD700,GR)
Tflex HD700 Thermal Pad product image showing thermal gap filler material
Tflex HD700PI Variant with Polyimide Film
Tflex™ HD700PI includes an integrated polyimide film on one side, providing electrical isolation, placement ease during assembly, and tear resistance for applications requiring shear.
Performance Advantages
  • Low pressure versus deflection characteristics
  • Excellent surface wetting for low contact resistance
  • Minimizes board and component stress
  • Suitable for large tolerance applications
  • Environmentally friendly solution meeting RoHS and REACH requirements
Target Industries
Aerospace/Defense, Automotive, Consumer Electronics, Industrial, Telecom/Datacom
Application Areas
  • Automotive ADAS and Electronics
  • Automotive Infotainment and Powertrain/ECUs
  • Drones and Satellites
  • Gaming Systems and Portable Devices
  • Instrumentation and Wireless Infrastructure
  • Smart Home Devices and Routers
ZSUN TECH thermal management solutions and applications
About ZSUN TECH
ZSUN TECH is an advanced enterprise with over 10 years of expertise in electronic components, specializing in EMC components, connectors, cables, and integrated circuits. Our professional team provides comprehensive EMC services including component selection, simulation, training, and corrective testing.
Contact Information
Sales Manager: Rose
Email: Rose@zsun-chips.com

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company ZSUN CHIPS CO., LTD
Location D202-A208, Building D, Guanghong Meiju, No. 163, Pingxin North Road, Hehua Community, Pinghu Street, Longgang District, Shenzhen, Guangdong, China
Contact Person Rose Luo

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