ZSUN CHIPS CO., LTD
                                                                                                           
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China Tflex HD300 Silicone Thermal Gap Filler Pad 2.7 W/mK - 0.5mm to 5mm Thickness Range for Electronics Cooling for sale
China Tflex HD300 Silicone Thermal Gap Filler Pad 2.7 W/mK - 0.5mm to 5mm Thickness Range for Electronics Cooling for sale
China Tflex HD300 Silicone Thermal Gap Filler Pad 2.7 W/mK - 0.5mm to 5mm Thickness Range for Electronics Cooling for sale

Tflex HD300 Silicone Thermal Gap Filler Pad 2.7 W/mK - 0.5mm to 5mm Thickness Range for Electronics Cooling

Price Negotiable
Price: Customize
MOQ: 1000pcs
Delivery Time: 1-3 weeks
Brand: Laird
Product Description
Tflex HD300 Thermal Gap Filler Overview
Laird Tflex HD300 is a high-performance silicone-based thermal gap filler with 2.7 W/mK thermal conductivity. This pink thermal pad is specifically designed for applications with wide manufacturing tolerances, effectively filling variable gaps while minimizing board and component stress.
Key Specifications
Property Value
Thermal Conductivity 2.7 W/mK
Standard Thickness Range 0.5mm to 5mm in 0.5mm increments
Custom Thickness Options 0.25mm increments available
Maximum Sheet Size 460mm x 460mm (18" x 18")
Technical Features & Benefits
  • Low pressure versus deflection characteristics for easy installation
  • Excellent surface wetting properties ensuring low contact resistance
  • Minimizes board and component stress during assembly
  • Ideal for applications with large manufacturing tolerances
  • RoHS and REACH compliant for environmental safety
Tflex HD300 thermal gap filler pad product image showing pink silicone material
Target Industries
  • Aerospace & Defense
  • Automotive Electronics
  • Consumer Electronics
  • Industrial Equipment
  • Telecom & Datacom Infrastructure
Primary Applications
Automotive ADAS systems, automotive electronics, infotainment systems, powertrain ECUs, drones, satellites, gaming systems, instrumentation, notebooks, tablets, portable devices, routers, smart home devices, and wireless infrastructure equipment.
Tflex HD300 thermal pad application in electronic device cooling Tflex HD300 thermal gap filler technical specifications and performance data
About ZSUN TECH
ZSUN TECH is a professional enterprise with over 10 years of expertise in electronic components, specializing in EMC components, connectors, cables, and integrated circuits. The company provides comprehensive EMC services including component selection, simulation, training, and corrective testing.
Contact Information
Sales Manager: Rose
Email: Rose@zsun-chips.com
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Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company ZSUN CHIPS CO., LTD
Location D202-A208, Building D, Guanghong Meiju, No. 163, Pingxin North Road, Hehua Community, Pinghu Street, Longgang District, Shenzhen, Guangdong, China
Contact Person Rose Luo

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