ZSUN CHIPS CO., LTD
                                                                                                           
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China Tflex HD7.5 Silicone Thermal Gap Filler Pad - 7.5W/mK Conductivity Grey High Deflection Material for sale
China Tflex HD7.5 Silicone Thermal Gap Filler Pad - 7.5W/mK Conductivity Grey High Deflection Material for sale
China Tflex HD7.5 Silicone Thermal Gap Filler Pad - 7.5W/mK Conductivity Grey High Deflection Material for sale

Tflex HD7.5 Silicone Thermal Gap Filler Pad - 7.5W/mK Conductivity Grey High Deflection Material

Price Negotiable
Price: Customize
MOQ: 1000pcs
Delivery Time: 1-3 weeks
Brand: Laird
Product Description
Tflex HD7.5 Silicone Thermal Gap Filler Pad
Tflex HD7.5 thermal gap filler pad product image showing material texture and application
Laird's Tflex™ HD7.5 gap filler is a newly developed very soft silicone material in our high deflection series. With a thermal conductivity of 7.5W/mK, Tflex™ HD7.5 is engineered to provide superior pressure versus deflection characteristics. The material delivers minimal stress on components during application while maintaining low thermal resistance, resulting in reduced mechanical and thermal stresses within your device.
Key Features & Benefits
  • 7.5 W/mK thermal conductivity soft silicone pad
  • Low pressure versus deflection performance
  • Minimizes board and component stress
  • Low outgassing and oil bleeding characteristics
Technical Specifications
Property Value
Thermal Conductivity 7.5 W/mK
Material Type Silicone-Based Thermal Gap Filler
Series High Deflection (HD)
Color Grey
Target Industries
Aerospace/Defense
Automotive
Consumer Electronics
Industrial Equipment
Telecom/Datacom
Primary Applications
Automotive ADAS, Automotive Electronics, Automotive Infotainment, Automotive Powertrain/ECUs, Drones/Satellites, Gaming Systems, Instrumentation, Notebooks/Tablets/Portable Devices, Routers, Smart Home Devices, Wireless Infrastructure
Tflex HD7.5 thermal pad application diagram showing component integration
Tflex HD7.5 thermal performance characteristics and testing data
About ZSUN TECH
ZSUN consists of a professional team with an average of over 10 years of expertise in electronic components. As an advanced enterprise specializing in research, development, production, and sales of EMC components, connectors, cables, and integrated circuits (ICs), we provide comprehensive EMC solutions including component selection, simulation, training, and corrective testing services.
Contact Information
Sales Manager: Rose
Email: Rose@zsun-chips.com
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Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company ZSUN CHIPS CO., LTD
Location D202-A208, Building D, Guanghong Meiju, No. 163, Pingxin North Road, Hehua Community, Pinghu Street, Longgang District, Shenzhen, Guangdong, China
Contact Person Rose Luo

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