ZSUN CHIPS CO., LTD
                                                                                                           
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China Tflex CR607 Two-Part Thermal Gap Filler Gel - 6.4W/m-K Thermal Conductivity with 1:1 Mix Ratio for sale
China Tflex CR607 Two-Part Thermal Gap Filler Gel - 6.4W/m-K Thermal Conductivity with 1:1 Mix Ratio for sale
China Tflex CR607 Two-Part Thermal Gap Filler Gel - 6.4W/m-K Thermal Conductivity with 1:1 Mix Ratio for sale

Tflex CR607 Two-Part Thermal Gap Filler Gel - 6.4W/m-K Thermal Conductivity with 1:1 Mix Ratio

Price Negotiable
Price: Customize
MOQ: 10 EA
Delivery Time: 1-3 weeks
Brand: Laird
Product Description
High-Performance Two-Part Thermal Interface Material
Tflex CR607 thermal gap filler product packaging and application
Tflex™ CR607 two-part liquid dispensable thermal gap filler gel delivers exceptional thermal performance with 6.4 W/m-K thermal conductivity. This advanced thermal interface material minimizes stress on components during assembly while providing the reliability of traditional thermal pads.
Key Technical Specifications
Parameter Specification
Thermal Conductivity 6.4 W/m-K
Mix Ratio 1:1
Packaging Options 50cc, 200cc, 400cc cartridges; 14kg and 20kg pail kits
Product Features & Benefits
  • Demonstrated thermal and vibration stability for demanding applications
  • Optimized for modern dispensing equipment with easy application
  • Compliant with RoHS and REACH regulatory requirements
  • Designed to pass stringent automotive industry vertical shock and vibration tests
  • Cure-in-place formulation perfectly fills gaps between components
Target Industries
Telecommunications, 5G Infrastructure, Consumer Electronics, Automotive Systems, Military Applications
Primary Applications
  • Automotive Powertrain and Engine Control Units (ECUs)
  • Automotive Advanced Driver Assistance Systems (ADAS)
  • Server and Data Center Cooling Systems
  • Wireless Infrastructure Equipment
  • Power Converters and Inverters
Tflex CR607 thermal gap filler application examples Tflex CR607 thermal gap filler technical specifications
About ZSUN TECH
ZSUN TECH is a professional enterprise with over 10 years of expertise in electronic components, specializing in EMC components, connectors, cables, and integrated circuits. Our team provides comprehensive EMC services including component selection, simulation, training, and corrective testing.
Contact Information
Sales Manager: Rose
Email: Rose@zsun-chips.com
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Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company ZSUN CHIPS CO., LTD
Location D202-A208, Building D, Guanghong Meiju, No. 163, Pingxin North Road, Hehua Community, Pinghu Street, Longgang District, Shenzhen, Guangdong, China
Contact Person Rose Luo

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