Customized Copper Beryllium EMI Contact Finger SMD Gaskets - Gold Plated SMT Side Spacer Type 2.5-15mm
Price:
Customize
MOQ:
Customize
Delivery Time:
1-3 weeks
Brand:
Nanker
Product Description
EMI Contact Finger SMD Gaskets
Customized copper beryllium EMI contact fingers with gold plating, designed for surface mount technology (SMT) applications requiring reliable electromagnetic interference shielding.
Product Specifications
| Finger P/N | Shape | Width (mm) | Length (mm) | Height (mm) | Material | Plating Type | Stroke | Remark |
|---|---|---|---|---|---|---|---|---|
| B3G-25X48X070 | 3 | 2.5 | 4.8 | 7 | BeCu | Au | 0.50~2.50 | |
| B3G-25X48X100 | 3 | 2.5 | 4.8 | 10 | BeCu | Au | 0.10~3.00 | |
| B3G-25X70X090 | 3 | 2.5 | 7 | 9 | BeCu | Au | 0.10~2.50 | |
| B3G-30X60X100 | 3 | 3 | 6 | 10 | BeCu | Au | 0.10~3.00 | |
| B4G-25X40X054 | 4 | 2.5 | 4 | 5.4 | BeCu | Au | 0.20~2.00 | |
| B5G-20X30X031 | 5 | 2 | 3 | 3.1 | BeCu | Au | 0.30~1.00 | |
| B5G-20X70X062 | 5 | 2 | 7 | 6.2 | BeCu | Au | 0.70~2.70 | |
| B5G-25X40X041 | 5 | 2.5 | 4 | 4.1 | BeCu | Au | 0.30~1.50 | |
| B5G-25X45X060 | 5 | 2.5 | 4.5 | 6 | BeCu | Au | 0.30~2.50 | |
| B5G40X40X051 | 5 | 4 | 4 | 5.1 | BeCu | Au | 0.50~2.00 | |
| B5G-95X47X060 | 5 | 9.5 | 4.7 | 6 | BeCu | Au | 0.30~2.50 | |
| B6G-20X75X030 | 6 | 2 | 7.5 | 3 | BeCu | Au | NA | side contact |
| B7G-25X40X050 | 7 | 2.5 | 4 | 5 | BeCu | Au | 0.25~1.50 | |
| B8G-20X40X037 | 8 | 2 | 4 | 3.7 | BeCu | Au | 0.50~1.20 | |
| B8G-20X45X045 | 8 | 2 | 4.5 | 4.5 | BeCu | Au | 0.50~1.50 | |
| B8G-25X150X100 | 8 | 2.5 | 15 | 10 | BeCu | Au | 0.20~1.00 | |
| B8G-25X70X062 | 8 | 2.5 | 7 | 6.2 | BeCu | Au | 0.50~2.50 | |
| B8G-30X40X051 | 8 | 3 | 4 | 5.1 | BeCu | Au | 0.50~1.80 | |
| BCG-20x30x025 | C | 2 | 3 | 2.5 | BeCu | Au | 0.25~0.80 | |
| BCG-20X30X040 | C | 2 | 3 | 4 | BeCu | Au | 0.30~1.20 | |
| BCG-20X32X015 | C | 2 | 2.3 | 1.5 | BeCu | Au | 0.20~0.50 | |
| BCG-20X32X035 | C | 2 | 3.2 | 3.5 | BeCu | Au | 0.50~1.50 | |
| BCG-20X35X031 | C | 2 | 3.5 | 3.1 | BeCu | Au | 0.30~1.00 | |
| BCG-20X35X035 | C | 2 | 3.5 | 3.5 | BeCu | Au | 0.30~1.00 | |
| BCG-20X38X020 | C | 2 | 3.8 | 2 | BeCu | Au | 0.30~0.50 | |
| BCG-20X40X020 | C | 2 | 4 | 2 | BeCu | Au | 0.30~0.60 |
Application Areas
• ESD Grounding Function: Notebook, PDA, Digital Still Camera, etc.
• Wire Clipper Function: Notebook LCD panel inverter line and embedded systems
• Side Contact Function: Contact between motherboard and case
• Slide Contact Function: Notebook PCMCIA card or drawable disk drive contact
• Antenna Contact Function: Mobile phone signal connection between motherboard and antenna
Material Characteristics
Copper Beryllium alloy offers exceptional strength and conductivity, making it ideal for applications requiring heat dissipation and current carrying capacity.
Key Features
• High strength and high conductivity alloy
• Excellent thermal and electrical conductivity
• Lower density than conventional special coppers
• Available in various product forms
Product Benefits
• Taping and reel packaging for SMT machine compatibility
• Compact size suitable for handheld equipment
• Gold plating ensures superior contact reliability
• Resistant to salt-spray and thermal shock testing
Physical Properties
| Item | Value |
|---|---|
| Density (g/cm³) | 8.36 |
| Thermal Expansion Coefficient (20℃~200℃) | 9.7x10⁻⁶ m/m/℃ |
| Thermal Conductivity | 0.25 cal/(cm.s.℃) |
| Melting Temperature | 870~980℃ |
Mechanical and Electrical Properties
| Item | Before Treatment | After Treatment (2hr 315℃) |
|---|---|---|
| Tensile Strength (Kgf) | 67~70 | 141~152 |
| Yielding Strength (Kgf) | 127~138 | |
| Elongation Percentage (%) | 21 | 3 |
| Hardness (HV) | 176~216 | 410~435 |
| Conductivity Percentage (IACS) | 22~28 | Good in Au plated |
About ZSUN TECH
ZSUN TECH specializes in EMC components, connectors, cables, and integrated circuits with over 10 years of industry expertise. Our professional team provides comprehensive EMC solutions including component selection, simulation, training, and corrective testing services.
Contact Information
Sales Manager: Rose
Email: Rose@zsun-chips.com
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
ZSUN CHIPS CO., LTD
Location
D202-A208, Building D, Guanghong Meiju, No. 163, Pingxin North Road, Hehua Community, Pinghu Street, Longgang District, Shenzhen, Guangdong, China
Contact Person
Rose Luo