Thermal Paper Photographic Developer 177325-75-6 HEAT SENSITIZING COUPLER AGENTS DBSP Bis(Phenylsulfonyl)Phenol
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Brand:
Dike
Product Description
DBSP Bis(Phenylsulfonyl)Phenol Thermal Paper Photographic Developer
Product Description
Chemical Name:DBSP Bis(Phenylsulfonyl)Phenol Thermal Paper Photographic Developer
Molecular formula: C18H14O5S2
Molecular weight: 374.43
CAS NO. 177325-75-6
1) Product Features:
High purity.
2) Quality Standards: Q/LZ 99-2008
Appearance: White powder
Purity: min 99%
Melting point: 155-157℃
loss on drying:≤0.30%
3) Application
Usage: Thermal Paper Photographic Developer,Heat Sensitizing Coupler Agents
Chemical nature
| Product | DBSP |
| Appearance | White powder |
| Purity | min 99% |
| Melting point | 155-157℃ |
| loss on drying | ≤0.30% |
| Usage | Thermal Paper Photographic Developer |
| Characteristic | High purity |
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Company
Wuhan Dike Surface Technology CO., Ltd
Location
18 Floor ,4th Building,Second Phase,Haixia IBD.No,9th,Qixiong Road,Dongxihu District,Wuhan City,Hubei Province,China
Contact Person
Deng