Wuhan Dike Surface Technology CO., Ltd
                                                                                                           
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Thermal Paper Photographic Developer 177325-75-6 HEAT SENSITIZING COUPLER AGENTS DBSP Bis(Phenylsulfonyl)Phenol

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Brand: Dike
Product Description

DBSP Bis(Phenylsulfonyl)Phenol Thermal Paper Photographic Developer

 

Product Description
Chemical Name:DBSP Bis(Phenylsulfonyl)Phenol Thermal Paper Photographic Developer

Molecular formula: C18H14O5S2
Molecular weight: 374.43

CAS NO. 177325-75-6
 
1) Product Features:
High purity.


2) Quality Standards: Q/LZ 99-2008

Appearance: White powder
Purity: min 99%
Melting point: 155-157℃

loss on drying:≤0.30%

 
3) Application
Usage: Thermal Paper Photographic Developer,Heat Sensitizing Coupler Agents 


 Chemical nature

Product DBSP
Appearance White powder
Purity min 99% 
Melting point 155-157℃
loss on drying ≤0.30%
Usage Thermal Paper Photographic Developer
Characteristic High purity

 
 
 
 

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Company Wuhan Dike Surface Technology CO., Ltd
Location 18 Floor ,4th Building,Second Phase,Haixia IBD.No,9th,Qixiong Road,Dongxihu District,Wuhan City,Hubei Province,China
Contact Person Deng

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