Insulation Performance Alumina Ceramic Bases For Precision Measurement Equipment And Industrial Inspection
Insulation Performance Alumina Ceramic Bases For Precision Measurement Equipment And Industrial Inspection
These alumina ceramic support bases are manufactured using 99.6% high-purity Al₂O₃ material, specifically designed for semiconductor, optical, and precision measurement equipment. Featuring ultra-high flatness of 0.01mm/m and a thermal expansion coefficient of 7.2×10⁻⁶/℃, the products maintain exceptional dimensional stability in extreme temperatures (-60℃~1500℃) and vacuum environments (≤10⁻⁸Pa).
Core Application Fields
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Semiconductor Equipment: Lithography wafer stages, etching reactor chamber bases
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Precision Optics: Laser interferometer reference platforms, space telescope mirror mounts
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Analytical Instruments: Electron microscope sample stages, mass spectrometer ion source supports
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Industrial Inspection: CMM machine bases, roundness tester turntables
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New Energy: Fuel cell stack supports, photovoltaic coating equipment carriers
Performance Advantage Matrix
| Characteristic | Technical Specification | Application Value |
|---|---|---|
| Thermal Stability | ΔL/L<0.001%/℃ | Eliminates thermal drift errors |
| Vacuum Compatibility | Outgassing rate<10⁻¹¹Pa·m³/s | Maintains ultra-high vacuum |
| Mechanical Strength | Flexural strength>400MPa | Supports precision components without deformation |
| Insulation Performance | Volume resistance>10¹⁶Ω·cm | Eliminates electrical leakage interference |
Technical Specifications
| Parameter | Standard Type | High-Precision Type |
|---|---|---|
| Material Purity | 99.6% Al₂O₃ | 99.9% Al₂O₃ |
| Flatness | ≤0.02mm/m | ≤0.005mm/m |
| Surface Roughness | Ra0.1μm | Ra0.025μm |
| Thermal Expansion Coefficient | 7.5×10⁻⁶/℃ | 7.2×10⁻⁶/℃ |
| Vacuum Leak Rate | <10⁻¹⁰mbar·L/s | <10⁻¹¹mbar·L/s |
Precision Manufacturing Process
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Powder Processing: 0.1μm high-purity powder with spray granulation
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Forming Process: Isostatic pressing (300MPa) combined with CNC green machining
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Sintering Technology: Gradient sintering at 1700℃ in hydrogen atmosphere
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Precision Machining:
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5-axis grinding (±0.002mm)
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Magnetorheological polishing (surface accuracy λ/20@632.8nm)
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Cleanroom Processing: Assembly completed in Class 100 cleanroom
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Full Inspection: Laser interferometer + CMM complete dimensional inspection
Installation Guidelines
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Installation Requirements:
✓ Use torque wrench (recommended value 1.5±0.2N·m)
✓ Use dedicated cleanroom tools
✓ Recommended thermal matching pre-adjustment (temperature gradient <2℃/min) -
Environmental Limitations:
✗ Avoid contact with hydrofluoric acid
✗ Avoid thermal shocks >200℃/min
✗ Not suitable for continuous >1600℃ oxidizing environments
Service Commitment
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Technical Support: Free FEA stress analysis
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Rapid Response: 72-hour expedited service
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Traceability Management: 10-year complete production records
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Certification Support: SEMI/FDA/ISO certification documents provided
FAQ
Q: How to ensure thermal matching with silicon carbide components?
A: CTE gradient transition design available (adjustable 7.2-4.5×10⁻⁶/℃)
Q: Maximum processable dimensions?
A: Current technical limit 500×500×100mm (special tooling required)
Q: Is conductive modification supported?
A: Customizable antistatic versions with surface resistance 10⁴-10¹⁰Ω
Q: How is wafer-level cleanliness guaranteed?
A: Final sterilization with VHP (vaporized hydrogen peroxide)
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.