Silicon Carbide Ceramics Superior Optical Properties and Thermal Shock Resistance for High-Performance Applications
Hexagonal Silicon Carbide Ceramic Plate - High-Strength & Modular Design
Product Overview
This industrial-grade silicon carbide ceramic plate features a precision-engineered hexagonal structure manufactured through advanced pressureless sintering. Characterized by its distinctive dark-gray hue and dense molecular structure, the plate boasts a uniform matte-finish surface that ensures optimal performance in demanding applications. The monolithic construction with precision-chamfered edges enables seamless modular assembly while eliminating structural weaknesses.
Key Features
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Superior Wear Resistance: Surface hardness exceeding HRA92, delivering 10x longer service life than conventional tool steel
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High-Temperature Endurance: Maintains structural integrity and dimensional stability at continuous operating temperatures up to 1450°C
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Advanced Thermal Management: Exceptional thermal conductivity (130 W/m·K) coupled with reliable electrical insulation
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Chemical Resilience: Excellent resistance to acidic and alkaline environments, ensuring longevity in corrosive applications
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Modular Configuration: Geometric design allows for seamless tiling and flexible layout configurations
Application Scenarios
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Semiconductor Processing: Diffusion furnace carriers, wafer handling fixtures, vacuum chamber components
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Energy Systems: Fuel cell separators, photovoltaic processing plates, battery production molds
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Precision Manufacturing: Coordinate measuring machine platforms, linear motion guide components
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Thermal Processing: Kiln furniture systems, heat treatment fixtures, high-temperature conveyor segments
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Electronics Thermal Management: Power electronics substrates, RF microwave components
Technical Specifications
| Parameter | Value |
|---|---|
| Material Composition | Pressureless Sintered SiC |
| Configuration | Regular Hexagonal Plate |
| Bulk Density | ≥3.14 g/cm³ |
| Hardness Scale | HRA92-94 |
| Compressive Strength | ≥2200 MPa |
| Maximum Service Temperature | 1450°C (air atmosphere) |
| Thermal Conductivity | 125-135 W/(m·K) |
| Surface Texture | Ra 0.4-0.8 μm |
Manufacturing Process
Raw material purification → Formula optimization → Granulation → Biaxial pressing → Sintering cycle → Multi-surface grinding → Edge profiling → Ultrasonic cleaning → Dimensional verification → Quality certification
Installation Guidelines
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Prepare mounting surfaces to achieve contamination-free conditions
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Maintain 0.5-1.0mm inter-plate spacing to accommodate thermal expansion
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Utilize specialized installation tools to prevent mechanical impact damage
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Implement regular inspection protocols for connection integrity
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Perform cleaning procedures using approved non-abrasive materials
Service Commitment
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24-month product warranty with comprehensive technical support
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Lifetime application engineering consultation
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On-site installation supervision available
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Emergency replacement service for qualified claims
Technical Q&A
Q: What dimensional tolerance can be achieved for modular assembly?
A: Our CNC grinding process ensures assembly gaps under 0.2mm with superior surface coplanarity.
Q: Are these plates suitable for ultra-high vacuum environments?
A: Yes, the low outgassing rate meets vacuum system requirements for semiconductor and research applications.
Q: Do you provide custom geometric configurations?
A: We offer comprehensive customization services including size modifications and special geometric requirements.
Q: How does thermal performance compare with aluminum nitride?
A: While maintaining better mechanical strength, our SiC plates provide 85% of AlN's thermal conductivity at 60% of the cost.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.