High-Power Electronic Devices Alumina Ceramic Substrates With Heat Dissipation And Superior Insulation
High-Power Electronic Devices Alumina Ceramic Substrates with Heat Dissipation and Superior Insulation
Product Introduction
Our alumina ceramic insulation heat sink substrates are manufactured from 99.6% high-purity alumina material, specifically engineered for thermal management and electrical insulation requirements in high-power electronic devices. Featuring excellent thermal conductivity (24-30W/(m·K)) and ultra-high insulation strength (>15kV/mm), with precision-polished surfaces achieving roughness below Ra 0.1μm, these substrates represent the ideal solution for high-temperature, high-power applications including power semiconductors, LEDs, and IGBT modules.
Primary Applications
-
Power Electronics: IGBT modules, MOSFETs, thyristor heat sinks
-
LED Lighting: High-power LED chip packaging substrates
-
New Energy Vehicles: Motor controllers, charging pile power modules
-
5G Communications: Base station power amplifier heat sinks
-
Industrial Control: Frequency converters, servo drive power units
Key Advantages
⚡ Efficient Heat Dissipation: Thermal conductivity up to 30W/(m·K), 10× better than standard PCBs
⚡ Superior Insulation: Breakdown voltage >15kV/mm, volume resistivity >10¹⁴Ω·cm
⚡ High-Temperature Resistance: Continuous operation up to 850°C
⚡ Dimensional Stability: CTE 7.2×10⁻⁶/℃, excellent match with chips
⚡ Precision Machining: Flatness ≤0.02mm/50mm, laser-cuttable
Technical Specifications
| Parameter | Standard (96%) | High-Performance (99.6%) |
|---|---|---|
| Al₂O₃ Content | 96% | 99.6% |
| Thermal Conductivity (W/(m·K)) | 24 | 30 |
| Flexural Strength (MPa) | 300 | 400 |
| Dielectric Constant (1MHz) | 9.5 | 9.2 |
| Thickness Range (mm) | 0.25-5.0 | 0.25-5.0 |
| Maximum Size (mm) | 150×150 | 150×150 |
Precision Manufacturing Process
-
Powder Preparation: High-purity alumina powder (D50≤0.8μm)
-
Tape Casting: Precise slurry viscosity and thickness control
-
Isostatic Pressing: 200MPa high-pressure densification
-
Atmosphere Sintering: 1650°C hydrogen-protected sintering
-
Precision Machining: Double-side grinding + laser cutting
-
Surface Treatment: CMP polishing to Ra 0.1μm
-
Full Inspection: AOI + insulation testing
Installation Guidelines
⚠ Professional Recommendations:
-
Soldering temperature <280°C, duration <10 seconds
-
Apply thermal grease to enhance thermal contact
-
Avoid mechanical impact and localized stress concentration
-
Storage humidity <60% RH
-
Recommend regular insulation checks (every 5,000 hours)
Service Commitment
-
Technical Support: Thermal simulation analysis services
-
Rapid Response: 48-hour expedited delivery for standard sizes
-
Customization: Special shapes and metallization treatments available
-
Failure Analysis: SEM+EDS testing laboratory equipped
Technical FAQ
Q: How to select proper substrate thickness?
A: 0.63mm recommended for general power devices, ≥1.0mm for high-power applications
Q: Is double-side metallization possible?
A: Supports thick-film printing, thin-film sputtering, DBC and other metallization processes
Q: How to ensure reliability in vibration environments?
A: Recommend our patented edge reinforcement structure design
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.