Ultra-High Thermal Conductivity Silicon Nitride Ceramics For Power Electronics And New Energy Vehicles
Ultra-High Thermal Conductivity Silicon Nitride Ceramics for Power Electronics and New Energy Vehicles
Silicon nitride (Si₃N₄) ceramic substrates are manufactured using 99.5% high-purity raw materials through tape casting and gas pressure sintering processes. The products exhibit excellent thermal conductivity, high strength and reliability, making them an ideal thermal management solution for next-generation high-power electronic devices.
Primary Applications
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Power electronics: IGBT, SiC power modules
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New energy vehicles: Motor controllers, OBC
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Rail transportation: Traction converters
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PV inverters: High-power photovoltaic modules
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5G communications: Base station RF devices
Key Advantages
✓ Ultra-high thermal conductivity: ≥90W/(m·K)
✓ High strength & toughness: Flexural strength ≥600MPa
✓ Low thermal expansion: CTE 3.2×10⁻⁶/°C
✓ Excellent insulation: Volume resistivity >10¹⁴Ω·cm
✓ Superior reliability: Passes 1000 cycles of -40~150°C thermal shock test
Technical Specifications
| Parameter | Specification | Test Standard |
|---|---|---|
| Material Purity | Si₃N₄≥99.5% | GB/T 16535 |
| Dimensional Accuracy | ±0.1% | IPC-4101 |
| Thermal Conductivity | ≥90W/(m·K) | ASTM E1461 |
| Flexural Strength | ≥600MPa | ISO 14704 |
| CTE | 3.2×10⁻⁶/°C | DIN 51045 |
| Dielectric Strength | ≥25kV/mm | IEC 60672 |
| Surface Roughness | Ra≤0.2μm | ISO 4287 |
Manufacturing Process
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Material preparation: Nano-grade Si₃N₊ powder modification
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Tape casting: Producing 0.1-1.2mm green tapes
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Isostatic pressing: 200MPa densification
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Gas pressure sintering: 1850°C/10MPa N₂ atmosphere
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Precision machining: Laser cutting, drilling
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Surface treatment: Double-side polishing to Ra≤0.2μm
Usage Guidelines
⚠️ Storage: Vacuum packed, moisture and dust proof
⚠️ Soldering: Recommended active metal brazing
⚠️ Mounting stress: Control <50MPa assembly stress
⚠️ Thermal design: Recommended with thermal grease
After-Sales Service
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Warranty: 36-month quality guarantee
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Technical support: Free thermal design consultation
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Testing service: Third-party test reports available
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Customization: Special sizes and structures
FAQ
Q: Advantages vs AlN substrates?
A: Main advantages:
① 3-5x higher strength
② Better thermal shock resistance
③ Higher reliability
Q: Maximum processable size?
A: Standard 200×200mm, special process up to 300×300mm.
Q: Recommended metallization?
A: Options include:
• DBC direct bonding copper
• AMB active metal brazing
• Thick film printing
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.