Newest hifu micro pulsed ultrasonic system TT MPTSTL MP mode (multi -point line )417 points/1 round Face Lift

Working Principle

The instrument utilizes an ultra-micro pulsed ultrasonic system to switch the bidirectional instantaneous energy of the transverse linear acoustic pulse and the annular acoustic wave. The single machine realizes the combination of point, line, and surface technology, achieving a full mode of 360 ° perfect seamless, full-layer anti-aging, multi-layer lifting and tightening, with precise, comfortable, fast, and lasting effffects.In MP mode, the microsecond energy transmission mode has smaller and denser focus points than other instruments, higher security,comfortable experience, shorter recovery period, more uniform and more.

Multi-dimensional—effective for anti-aging, skin lifting and tightening 2. A combination of point, line, and 360° annular treatment 3. 13.3-inch touch screen—for convenient and easy operation 4. 7 available probes+ 3 360° annular probes—for precise treatment on different treatment areas 5. Safe and non-invasive—wouldn`t cause any wound, and give you a comfortable and effective treatment

Application

Anti-aging

Face lifting

Skin tightening

Remove double chin

Wrinkle removal

Dark circle& eye bag removal

Enhance skin elasticity

body shaping

7 available probes+ 3 360° annular probes Depth: 1.5mm, 2.0mm, 3.0mm, 4.5mm, 6.0mm, 9.0mm, 13.0mm

1.5mm —— penetrating epidermis to reduce fine lines, shrink pores and improve skin texture in thinner tissue, e.g. eye zone, forehead.

2.0mm —— specially designed for wrinkle removal around eyes and mouth.

3.0mm —— penetrating deep dermis, accelerating collagen regeneration to lift skin, shrink pores and reduce wrinkles, targeting cheeks and chin. 4.5mm —— penetrating subcutaneous SMAS layer to tighten and lift skin, targeting thicker skin, e.g. cheeks, neck, etc.

6.0mm —— for double chin removal and body skin tightening.

9.0mm —— for skin tightening on abdomen, breasts and legs.

13.0mm —— for abdominal and buttock tightening.

Technical parameters