Suntek Electronics Co., Ltd.
                                                                                                           
Verified Supplier
14 Years
Since 2012
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Professional Multi-Layer PCB Assembly for Communication Devices - FR4 Material, 0.4mm-3mm Thickness, 21x24 Inch Panel

Price Negotiable
Price: Customized products
MOQ: 1pcs
Delivery Time: 5-7days after all components kitted
Brand: Suntek Electronics Co., Ltd
Product Description
Professional Communication PCB Assembly Services
Suntek Group delivers comprehensive EMS solutions including PCB/FPC assembly, cable assembly, mixed technology assembly, and box-build services through facilities in China and Cambodia.
Technical Capabilities
ParameterSpecification
LayersRigid PCB 2-40 Layers, Rigid-flex PCB 1-10 Layers
Panel Size (max)21" x 24"
PCB Thickness0.016" to 0.120" (0.4mm-3mm)
Line & Spaces0.003" / 0.003" Inner Layers; 0.004" Outer Layers
Hole Size0.006" Thru Hole (Finished Size) and 0.004" Buried Via
MaterialsFR4, High Tg, Rogers, Halogen-free material, Teflon, Polyimide
Surface FinishesENi/IAu, OSP, Lead-free HASL, Immersion Gold/Silver, Immersion Tin
Special ProductsBlind/Buried Via (HDI 2+N+2), Rigid Flex
Communication PCB Requirements
High-Frequency Performance
Optimized for microwave band operation (700 MHz to 5 GHz) with carefully selected substrates and lamination materials to minimize dielectric power loss and RF conduction path leakage.
High-Speed Signal Handling
Designed for multi-Gbps Wi-Fi 6 speeds with 4-6 mil line/space traces, tight impedance tolerance laminates, and robust power distribution networks.
EMI and Crosstalk Prevention
Advanced engineering techniques including stackup symmetry, selective isolation/shielding, ground stitching vias, and specialized treatments to eliminate EMI emission in dense multilayer layouts.
Quality and Reliability Standards
IPC Standards Compliance
ISO 9001 certified manufacturer adhering to IPC J-STD-001, IPC-A-600 and other industry quality specifications through disciplined fabrication workflows.
Advanced Quality Planning
Systematic reliability risk identification during NPI with process controls selection, PFMEA/DRBFM, and test vehicle measurements establishing performance baselines.
Complete Traceability
ERP software tracking from raw materials to finished boards with barcode work orders documenting each fabrication, inspection, and test operation.
Product Images
Professional multi-layer PCB assembly for communication devices High-frequency PCB with fine line traces and spaces Communication PCB assembly with EMI shielding Multi-layer rigid-flex PCB for high-speed applications PCB assembly with blind and buried vias Professional PCB manufacturing facility equipment Quality control inspection of communication PCBs Advanced PCB assembly line with automated testing High-density interconnect PCB with fine pitch components Communication PCB with multiple surface finish options

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Suntek Electronics Co., Ltd.
Location Building 3, No.68 Luositang Road,Changsha E&D Zone,Changsha,Hunan,China,410100
Contact Person Suntek Group Marketing Dept

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