Suntek Electronics Co., Ltd.
                                                                                                           
Verified Supplier
14 Years
Since 2012
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High-Performance Communication PCB Assembly for Wireless Routers & Base Stations - 2 Layer ENIG Finish, 0.2-7.0mm Thickness

Price Negotiable
Price: Customized products
MOQ: 1pcs
Delivery Time: 5-7days after all components kitted
Brand: Suntek Electronics Co., Ltd
Product Description
About Suntek Group

Suntek Contract Factory, located in Development Zone-Changsha City, is a leading EMS supplier with over 10 years of expertise in PCB assembly and cable assembly. Certified with ISO 9001:2015, ISO 13485, IATF 16949, and UL, we deliver high-quality products at competitive prices to global clients.

Technical Specifications
Parameter Specification
Surface Finished ENIG
PCB Layers 2 Layers
Minimum Hole Tolerance ±0.05mm
Plugging Vias Capability 0.2-0.8mm
PCBA Test AOI, X-RAY, ICT and Function Test
Service PCB & PCBA
PCB Thickness 0.2-7.0mm
PCB Process Immersion Gold
PCB Assembly Method BGA
Material Precision 0402+QFN+QFP
Communication PCB Applications

With the rapid development of information and communication technologies, PCBs serve as the foundation for component assembly and integrated circuits in devices like smartphones, wireless routers, and base stations. These specialized PCBs enable high-speed signal transmission and data communication through conductive copper traces etched from copper-clad laminate boards.

Key Applications Include:
  • Wireless communication systems
  • Mobile phone tower systems
  • Telephonic switching systems
  • PBX systems
  • Industrial wireless communication technology
  • Video conferencing technologies
  • Satellite systems and communication devices
  • High speed servers and routers
  • Electronic data storage devices
  • Digital and analog broadcasting systems
  • Voice over Internet Protocol (VoIP)
  • Security technology and information communication systems
5G Communication Technology

As the next generation mobile communication network, 5G infrastructure construction is expected to significantly boost demand for communication PCBs, including high-value products like backplanes, high-frequency high-speed boards, and multi-layer PCB boards.

Material Technology

While special substrates like polyimides and ceramics handle wider temperature swings, FR-4 laminates have evolved with "high Tg" versions usable to 150°C+ while maintaining lower costs and better fabricator familiarity, making them suitable for many industrial applications.

Product Images
High-performance communication PCB assembly for wireless routers PCB assembly with BGA components and immersion gold finish Communication PCB with precise component placement Multi-layer PCB board for base station applications High-frequency PCB assembly for wireless communication Industrial-grade PCB with ENIG surface finish Advanced communication PCB with QFN and QFP components Precision PCB assembly for 5G infrastructure Communication device PCB with high-density components Wireless router PCB assembly with comprehensive testing

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Suntek Electronics Co., Ltd.
Location Building 3, No.68 Luositang Road,Changsha E&D Zone,Changsha,Hunan,China,410100
Contact Person Suntek Group Marketing Dept

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