Custom Aluminum Radiation Fin Heatsink for High Power LED IC Chip Cooling - 15-30 Day Delivery with ISO9001 Certification
Price:
USD 2.7~3.0 PCS
MOQ:
200 PCS
Delivery Time:
8~15 working days
Brand:
ORIENS
Product Description
Product Overview
Premium aluminum radiation fin enclosure heatsink designed for high-power LED IC chip cooling applications. This advanced radiator ensures optimal thermal management for electronic components operating under heavy loads.
Key Features
Excellent thermal conductivity and high heat dissipation performance
Innovative radiation fin design for maximum airflow and heat dispersion
Premium aluminum alloy construction for durability and efficiency
Prevents overheating and damage to sensitive electronic components
Technical Specifications
| Parameter | Specification |
|---|---|
| Material | Aluminum Alloy |
| Shape | Flat |
| Length | Customizable according to requirements |
| Processing Services | Bending, Decoiling, Welding, Punching, Cutting |
| Deep Processing | CNC, Punching, Drilling, Tapping, Bending |
| Color | Customized |
| Standard | Middle and High Quality |
| Certifications | ISO9001, Material Reports, Dimensions Reports |
Applications
Ideal for IC, Diode, Dynatron, Electronic, LED, RAM, CHIP computer components and various electronic cooling requirements.
Customization & Services
OEM/ODM services available with various surface treatments
Custom color powder coating options
Free samples available (shipping cost applies)
Model making according to your design specifications
Quality assurance with 1:1 replacement for non-conforming products
Delivery & Logistics
Standard delivery time: 15-30 days
Express shipping available (5-7 days)
Sea freight for large quantity orders (30-35 days)
Product Images
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Oriens Technology Co., Ltd.
Location
Rm. 1010, Building D, Taihua Longqi Square, Changping Dist., Beijing, China
Contact Person
Jesing Ding