AOI SMT 3D Inspection Equipment System For Semiconductor

Price Negotiable

Price: Negotiable

MOQ: 1

Delivery Time: 20 work days

Brand: MENTO

Product Description

Down-illuminated AOI

1. High detection, low misjudgment

2. Unique chain track

3. Rich detection algorithms can effectively target DIP defects

4. Two-person re-judgment repair stations can be implemented according to the inspection ratio.

Application scope: solder joint and mounted device inspection

Device model		K2005DW
Detection capacity	Detection items	CHIP component body, CHIP component solder joints, characters, DIP solder joints
	Smallest component	CHIP:0201 Pitch:0.3mm
	Detection method	Algorithm parameter debugging, machine learning
Optical system	Camera	5MP high speed color industrial camera
	Telecentric lens	0.22X/0.17X
	Resolution	15um/20um/25um
	FOV	36x30mm/48x40mm/61x51mm
	Detection speed	3FOV/s
Software system	Operating system	Windows 10
Mechanical property	PCB Thickness	0.3~10mm(warpage≤5mm)
	Component Height	180mm upper, 30mm lower (special height can be customized)
	Driving equipment	Servo motor + ball screw + linear slide
	Moving speed	Max.600mm/s
	Positioning accuracy	≤8um(after calibration)
	PCB transport rail	PCB rail transportation height: 900±20mm (from the ground to the PCB guide rail transportation surface)
		PCB maximum size: 510mmx460mm
		PCB minimum spacing: ≤90mm
Parameters	Power source	AC220V/50Hz/2000W
	Overall size	W1140mmxD1400mmxH1600mm (excluding foot 100±20mm)
	Weight	≈700KG
	Air Pressure	≥0.5MPa
	Environmental requirements	Temperature: 5~40℃, relative humidity 25%~80% (no frost)
	Upstream and downstream equipment communication	Standard SMEMA interface