LED AOI Equipment
Automated Optical LED AOI Equipment PCB Inspection Machine
Model M20 Series Mini LED appearance inspection M2065 Inspection Inspection items Missed bonding, wrong bonding, die damaged, die offset, die tilted, die flipped, wrong polarity, particles, die lift-off, poor collinearity Inspection method Image processing, machine learning Optical System Camera 65MP Lens High resolution bi-telecentric lens Resolution 4μm(2.4μm~10μm optional)RGB(Customisable) Light Source RGB customizable Efficiency Stop then go:3FOV/s Computer Configuration
Automated Optical Wafer Defect Inspection System Machine Advanced
M20EL Series Mini LED luminescence inspection Model M1020EL Inspection Inspection items Bad die, over luminescence, under luminescence, chroma anomaly Inspection method Image processing, machine learning Optical Camera 20MP Lens FA Resolution 18μm 75μm Light Source RGB Computer configuration PC CPU:Inteli7, RAM:DDR4-32G, GPU:GTX1660-6G SSD:250G, HDD:2T Monitor 22 "LED Operating System Windows 10 Professional 64-bit/Ubuntu Performance Maximum allowable component height Upper
Automated Optical Inspection PCB AOI Machine Wafer Tester
ModelM20 Series Mini LED appearance inspection M2025InspectionInspection itemsMissed bonding, wrong bonding, die damaged, die offset, die tilted, die flipped, wrong polarity, particles, die lift-off, poor collinearityInspection methodImage processing, machine learningOptical SystemCamera65MP25MP20MP12MPLensHigh resolution bi-telecentric lensResolution4μm(2.4μm~10μm optional)RGB(Customisable)Light SourceRGB customizableEfficiencyStop then go:3FOV/sFlying shoot:10FOV/sComputer
100V-240V LED AOI Equipment 3D Inspection For Die Damaged Products
Model M20 Series Mini LED appearance inspection M2065 Inspection Inspection items Missed bonding, wrong bonding, die damaged, die offset, die tilted, die flipped, wrong polarity, particles, die lift-off, poor collinearity Inspection method Image processing, machine learning Optical System Camera 65MP Lens High resolution bi-telecentric lens Resolution 4μm(2.4μm~10μm optional)RGB(Customisable) Light Source RGB customizable Efficiency Stop then go:3FOV/s Computer Configuration
Bitelecentric Lens LED AOI Equipment For PCB Inspection OEM
M20EL Series Mini LED luminescence inspection Model M2012EL Inspection Inspection items Bad die, over luminescence, under luminescence, chroma anomaly Inspection method Image processing, machine learning Optical Camera 12MP Lens High resolution bi-telecentric lens Resolution 10μm 15μm Light Source RGB Computer configuration PC CPU:Inteli7, RAM:DDR4-32G, GPU:GTX1660-6G SSD:250G, HDD:2T Monitor 22 "LED Operating System Windows 10 Professional 64-bit/Ubuntu Performance Maximum
Industrial Semiconductor Wafer Inspection Equipment Tester Machine Custom
Model RD30 Fully Automatic Rework RD30K Basic Function Function Defective die removing, residues cleaning, solder paste/adhesive printing, die bonding, solder curing, luminescence inspection Wafer size 3x5mil-20x20mil Substrate compatibility FR-4, BT substrate, glass substrate, FPC, etc. Maximum board size 380mmx280mm Removing Removing,method Physical Residue cleaning Direct removal + heating suction Height measurement Laser measurement 0.001mm Printing Motion XYZ (linear way
Ethernet Optical LED AOI Equipment For Wafer Test
M20EL Series Mini LED luminescence inspectionModelM2012ELInspectionInspection itemsBad die, over luminescence, under luminescence, chroma anomalyInspection methodImage processing, machine learningOpticalCamera12MPLensHigh resolution bi-telecentric lensResolution10μm15μmLight SourceRGB Computer configurationPCCPU:Inteli7, RAM:DDR4-32G, GPU:GTX1660-6G SSD:250G, HDD:2TMonitor22 "LEDOperating SystemWindows 10 Professional 64-bit/UbuntuPerformanceMaximum allowable component
Multi Angle Solder Paste Inspection Equipment PCB Visual Inspection Machine
Model RD30 Fully Automatic Rework RD30L Basic Function Function Defective die removing, residues cleaning, solder paste/adhesive printing, die bonding, solder curing, luminescence inspection Wafer size 3x5mil-20x20mil Substrate compatibility FR-4, BT substrate, glass substrate, FPC, etc. Maximum board size 380mmx280mm Removing Removing,method Laser Residue cleaning Direct removal + heating suction Height measurement Laser measurement 0.001mm Printing Motion XYZ (linear way)
Custom Wafer SMT Inspection Equipment High Resolution
M20EL Series Mini LED luminescence inspection Model M2012EL Inspection Inspection items Bad die, over luminescence, under luminescence, chroma anomaly Inspection method Image processing, machine learning Optical Camera 12MP Lens High resolution bi-telecentric lens Resolution 10μm 15μm Light Source RGB Computer configuration PC CPU:Inteli7, RAM:DDR4-32G, GPU:GTX1660-6G SSD:250G, HDD:2T Monitor 22 "LED Operating System Windows 10 Professional 64-bit/Ubuntu Performance Maximum
Automated Optical Inspection LED AOI Equipment Wafer Testing Machine
Model M20 Series Mini LED appearance inspection M2020 Inspection Inspection items Missed bonding, wrong bonding, die damaged, die offset, die tilted, die flipped, wrong polarity, particles, die lift-off, poor collinearity Inspection method Image processing, machine learning Optical System Camera 20MP Lens High resolution bi-telecentric lens Resolution 4μm(2.4μm~10μm optional)RGB(Customisable) Light Source RGB customizable Efficiency Stop then go:3FOV/s Computer Configuration
ODM SMT SPI Machine Semiconductor Wafer Inspection Equipment LED Lighting
Model M20 Series Mini LED appearance inspection M2012 Inspection Inspection items Missed bonding, wrong bonding, die damaged, die offset, die tilted, die flipped, wrong polarity, particles, die lift-off, poor collinearity Inspection method Image processing, machine learning Optical System Camera 12MP Lens High resolution bi-telecentric lens Resolution 4μm(2.4μm~10μm optional)RGB(Customisable) Light Source RGB customizable Efficiency Flying shoot:10FOV/s Computer Configuration
240V RGB LED AOI Equipment Automated Optical Inspection Machine
Model M20 Series Mini LED appearance inspection M2025 Inspection Inspection items Missed bonding, wrong bonding, die damaged, die offset, die tilted, die flipped, wrong polarity, particles, die lift-off, poor collinearity Inspection method Image processing, machine learning Optical System Camera 65MP 25MP 20MP 12MP Lens High resolution bi-telecentric lens Resolution 4μm(2.4μm~10μm optional)RGB(Customisable) Light Source RGB customizable Efficiency Stop then go:3FOV/s Flying
USB RS232 Semiconductor Inspection System Wafer Inspection Equipment
Model RD30 Fully Automatic Rework RD30K Basic Function Function Defective die removing, residues cleaning, solder paste/adhesive printing, die bonding, solder curing, luminescence inspection Wafer size 3x5mil-20x20mil Substrate compatibility FR-4, BT substrate, glass substrate, FPC, etc. Maximum board size 380mmx280mm Removing Removing,method Physical Residue cleaning Direct removal + heating suction Height measurement Laser measurement 0.001mm Printing Motion XYZ (linear way
Mini LED AOI Equipment Printed Circuit Inspection High resolution
Model RD30 Fully Automatic Rework RD30L Basic Function Function Defective die removing, residues cleaning, solder paste/adhesive printing, die bonding, solder curing, luminescence inspection Wafer size 3x5mil-20x20mil Substrate compatibility FR-4, BT substrate, glass substrate, FPC, etc. Maximum board size 380mmx280mm Removing Removing,method Laser Residue cleaning Direct removal + heating suction Height measurement Laser measurement 0.001mm Printing Motion XYZ (linear way)
LED AOI Wafer Inspection Machine 3D Solder Paste 60Hz
M20EL Series Mini LED luminescence inspectionModelM2012ELInspectionInspection itemsBad die, over luminescence, under luminescence, chroma anomalyInspection methodImage processing, machine learningOpticalCamera12MPLensHigh resolution bi-telecentric lensResolution10μm15μmLight SourceRGB Computer configurationPCCPU:Inteli7, RAM:DDR4-32G, GPU:GTX1660-6G SSD:250G, HDD:2TMonitor22 "LEDOperating SystemWindows 10 Professional 64-bit/UbuntuPerformanceMaximum allowable component
Windows 10 LED AOI Equipment For Wafer Test 2000W
M20EL Series Mini LED luminescence inspection Model M2012EL Inspection Inspection items Bad die, over luminescence, under luminescence, chroma anomaly Inspection method Image processing, machine learning Optical Camera 12MP Lens High resolution bi-telecentric lens Resolution 10μm 15μm Light Source RGB Computer configuration PC CPU:Inteli7, RAM:DDR4-32G, GPU:GTX1660-6G SSD:250G, HDD:2T Monitor 22 "LED Operating System Windows 10 Professional 64-bit/Ubuntu Performance Maximum
ROHS AOI SPI SMT Solder Paste Inspection Machine Multi Angle
Model M20 Series Mini LED appearance inspection M2025 Inspection Inspection items Missed bonding, wrong bonding, die damaged, die offset, die tilted, die flipped, wrong polarity, particles, die lift-off, poor collinearity Inspection method Image processing, machine learning Optical System Camera 65MP 25MP 20MP 12MP Lens High resolution bi-telecentric lens Resolution 4μm(2.4μm~10μm optional)RGB(Customisable) Light Source RGB customizable Efficiency Stop then go:3FOV/s Flying
Integrated LED AOI Equipment For Semiconductor Inspection
Model M20 Series Mini LED appearance inspection M2020 Inspection Inspection items Missed bonding, wrong bonding, die damaged, die offset, die tilted, die flipped, wrong polarity, particles, die lift-off, poor collinearity Inspection method Image processing, machine learning Optical System Camera 20MP Lens High resolution bi-telecentric lens Resolution 4μm(2.4μm~10μm optional)RGB(Customisable) Light Source RGB customizable Efficiency Stop then go:3FOV/s Computer Configuration