Manual Chip Re-bonding Machine YCR-1 for RFID Inlay Production - 800-1200 Cards/Hour, 500×400×500mm
Price:
negotiable
MOQ:
1 set
Delivery Time:
10-15days after receiving the prepayment
Brand:
YL
Product Description
Product Overview
The Manual Chip Re-bonding Machine YCR-1 is engineered for precision bonding of copper wire onto contactless chips. Equipped with amplifier and display systems, it ensures accurate and high-quality bonding results essential for RFID card inlay sheet production.
Key Features
- Essential equipment for RFID card inlay and prelam sheet production lines
- Manual operation with precision bonding capability
- Integrated amplifier and display for quality control
- Versatile applications in contactless card manufacturing
Technical Specifications
| Parameter | Specification |
|---|---|
| Production Speed | 800-1200 cards per hour |
| Dimensions | 500×400×500mm (L×W×H) |
| Weight | 60 kg |
| Power Supply | AC220V 50/60HZ |
Application Process
Specifically designed for re-bonding defective units identified during quality inspection. The machine enables operators to re-bond chips that failed initial bonding, followed by retesting. Units that remain defective after re-bonding are marked for further processing.
Recommended Configuration
Machine Model: Manual Chip Re-bonding Machine YCR-1
Quantity Required: 1 set
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
YL Electrical Equipment (Tianjin) Co., Ltd.
Location
Add: No. 843 Shengli St., Dagang, Binhai New Area, Tianjin, China
Contact Person
Karlbing