YCGP-1 Contact IC Chip Tape Glue Preparation Machine with PLC Control and 400Kg Weight for 18,000 Chips/Hour
The YCGP-1 Contact IC Chip Tape Glue Preparation Machine is an automated system controlled by PLC programming. It utilizes imported high-quality stepper motors to transport IC module strips and hot melt glue for precise adhesive application. This industrial machine delivers high-speed production with exceptional glue preparation accuracy.
Designed for processing various contact IC chip and module tape types including 6-pin and 8-pin configurations, this equipment integrates multiple functions into a single streamlined operation.
| Parameter | Specification |
|---|---|
| Power Supply | AC220V 50/60 HZ |
| Main Power | Approximately 1.0 KW |
| Operator Requirement | 1 person |
| Production Speed | 9,000-12,000 chips/hour (2 hot welds) 15,000-18,000 chips/hour (1 hot weld) |
| Compressed Air | 6kg/cm² (dry oil free) |
| Air Consumption | Approximately 30L/min |
| Net Weight | Approximately 400Kg |
| Control System | PLC + Stepper Motor System |
| Bonding Mode | Hot melt glue (compatible with Tesa 8410, Scapa G175 or similar) |
| Module Specification | ISO standard contact IC card chip tape (M3/8-pin & M2/6-pin) |
| Machine Dimensions | Approximately L1700×W800×H1600mm |
Warranty: Comprehensive one-year guarantee period with efficient service response and on-site technical support when needed.
Standard export packaging with PE film internal protection and plywood case exterior for secure international transport.
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