YL Electrical Equipment (Tianjin) Co., Ltd.
                                                                                                           
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14 Years
Since 2012
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220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase

Price Negotiable
Price: negotiable
MOQ: 1 set
Delivery Time: 30-35days
Brand: YL
Product Description
220V Speed:9000 Cards/Hour IC Chip Tape Glue Preparation Machine YCGP-1 Single Phase 
Professional automated machine for 6-pin and 8-pin contact IC chip tape glue preparation with hot welding technology.
Machine Overview
The YCGP-1 machine features PLC program automatic control and utilizes imported high-quality stepper motors for precise transportation of IC module strips and hot melt glue. This ensures fast production speeds and high glue preparation precision.
YCGP-1 Contact IC Chip Tape Glue Preparation Machine overview
Key Features
  • Integrated system for IC module strip transportation, hot melt adhesive strip handling, glue flushing, hot welding preparation, and finished product collection
  • Hot welding glue preparation welding head with automatic correction and balance structure for superior glue preparation and convenient debugging
  • Hot welding and glue punching molds equipped with position fine-tuning mechanism for higher punching precision and easier operation
  • Modular mold structure design enables quick and easy replacement for different IC module types
  • Automatic monitoring and protection system with electric sensor eye for IC module stepping position
  • Automatic material belt discharge and receiving with alarm and shutdown for empty feed conditions
YCGP-1 machine features and components
Technical Specifications
Parameter Specification
Power AC220V 50/60 HZ
Main Power Approximately 1.0 KW
Operator 1 person
Compressed Air 6kg/cm² (dry oil free)
Air Consumption Approximately 30L/min
Net Weight Approximately 400Kg
Control Mode PLC + stepper system
Speed 9,000-12,000 chips/hour (2 times hot welding)
15,000-18,000 chips/hour (1 time hot welding)
Bonding Mode Hot melt glue (Tesa 8410, Scapa G175 or similar)
Module Specification ISO standard contact IC card chip tape (M3/8-pin & M2/6-pin)
Machine Size Approximately L1700×W800×H1600mm
YCGP-1 technical specifications and dimensions
Applications
The YCGP-1 machine is designed for the preparation and processing of various types of contact IC chip or module tapes, including 6-pin and 8-pin chip configurations.
YCGP-1 application examples for IC chip processing

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company YL Electrical Equipment (Tianjin) Co., Ltd.
Location Add: No. 843 Shengli St., Dagang, Binhai New Area, Tianjin, China
Contact Person Karlbing

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