Ceramic Part Ceramic Substrate

1. High thermal conductivity, meeting the heat dissipation requirements of devices;

2. Good heat resistance, meeting the high-temperature (more than 200℃) application requirements of power devices;

3. Thermal expansion coefficient matching, matching with the thermal expansion coefficient of chip material, reducing packaging thermal stress;

4. Low dielectric constant, good high frequency characteristics, reducing the signal transmission time of the device and improving the signal transmission rate;

5. High mechanical strength, meeting the requirements of mechanical properties in the process of device packaging and application;

6. Good corrosion resistance, able to withstand strong acid, strong alkali, boiling water, organic solution and other corrosion;

7. Compact structure, meeting the requirements of airtight packaging of electronic devices;

Silicon Nitride Ceramic Substrate

Note : As customers demands

Application:

high-power power semiconductor module; Semiconductor refrigerator, electronic heater; Power control circuit, power hybrid circuit. Intelligent power components; High frequency switching power supply, solid state relay. Automotive electronics, aerospace and military electronic components. Solar panel assembly; Telecommunications private exchange, receiving system; Laser and other industrial electronics.

1. Q : Are you manufacturer ?
    A : Yes , we are manufacturer and product more than 10 years .

 2.Q : Can you provide free samples ?
    A : Yes , The sample is free  .

 3.Q: What is your MOQ ?
    A : 1 pcs , We accept smaller quantity but price is higher .

 4.Q : What is your production time for bulk order ?
    A :   7-10 days ,  According to order quantity .