Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
Price:
Negotiable
MOQ:
≥1 pc
Delivery Time:
25~50 days
Brand:
Suneast
Product Description
Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
Product Overview
The WBD2200 IC Bonder is a high-precision multilayer bonding machine designed for multi-chip placement. Featuring advanced vision systems and thermal compensation algorithms, it delivers exceptional accuracy and speed for industrial semiconductor applications.
Key Specifications
| Attribute | Specification |
|---|---|
| Model | WBD2200 |
| Machine Dimensions | 1255(L)×1625(W)×1610(H)mm |
| Placement Accuracy | ±15um@3σ |
| Die Size Range | 0.25×0.25mm to 10×10mm |
| Substrate Size | 150(L)×50(W) to 300(L)×100(W)mm |
| Substrate Thickness | 0.1-2mm |
| Placement Pressure | 30-7500g |
| Glue Feeding Modes | Dispensing, Dipping Glue, Painting Glue |
| Customization | Available |
Advanced Features
- Multilayer Capability: Supports complex multi-chip configurations
- System-in-Package Technology: Ideal for advanced SIP applications
- Ultrathin Die Bonding: Precision handling of delicate components
- Supermini Chip Bonding: Capable of handling chips as small as 0.25×0.25mm
- Quick Changeover: Minimizes downtime between production runs
Industrial Applications
The WBD2200 is suitable for IC, WLCSP, TSV, SIP, QFN, LGA, and BGA processes. Ideal for manufacturing optical communication modules, camera modules, LED components, power modules, vehicle electronics, 5G RF components, memory devices, MEMS, and various sensors.
Technical Parameters
| Parameter | Specification |
|---|---|
| Placement Accuracy | ±15um@3σ |
| Wafer Size | 4"/6"/8" (Optional: 12") |
| Placement Head | 0-360° rotation with auto-change nozzle (optional) |
| Core Motion Module | Linear motor + grating scale |
| Machine Base | Marble platform for stability |
| Loading/Unloading | Manual or automatic options |
Installation Requirements
1. Leakage protection switch: ≥100ma
2. Compressed air: 0.4-0.6Mpa (Inlet pipe: Ø10mm)
3. Vacuum requirement: <-88kPa (Inlet pipe: Ø10mm, 2 tracheal joints)
4. Power: AC220V, 50/60Hz (Three core power copper wire ≥2.5mm², 50A leakage protection switch ≥100mA)
5. Floor loading capacity: ≥800kg/m²
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
Location
Suneast Ind.Park, No.13, Yongping 2nd Rd., Fuyong Street, Bao'an District, Shenzhen city,Guangdong Prov., China
Contact Person
Yang