The Semiconductor Oven SEO Series features high capacity PID adjustment with excellent air tightness for nitrogen-filled environments. Designed for semiconductor wafer curing, IC packages, and glass substrates, this oven delivers superior temperature uniformity and stability.

• Horizontal Air Recirculation: High capacity system ensures superior temperature uniformity
• Fully Sealed Chamber: Stainless steel construction with excellent air tightness for nitrogen efficiency
• High Temperature Motor: Long-axis motor with large turbine blades for stable high-temperature operation
• Precision Control: PID adjustment with 0.5℃ accuracy and programmable process profiles
• Cleanroom Compatibility: Meets thousand-grade cleanroom standards for semiconductor production
• Oxygen Control: Dual channel analysis maintains oxygen content below 50PPM

Features upper and lower hot air circulation systems with adjustable airflow. Constructed with high-quality stainless steel and layered brackets for optimal space utilization.

Equipped with multiple flow meters and oxygen analyzers for real-time monitoring. Maintains oxygen content below 500PPM (option for 100PPM).

Water cooling with fin radiator blast technology reduces cooling time while preventing product damage from rapid temperature changes.

Includes over-temperature protection, oxygen content monitoring, nitrogen pressure alarms, electronic safety locks, and emergency stop switch.

Particle concentration ≤35,200 (0.5μm) meets thousand-class cleanroom standards.

High precision temperature control with PID regulation ensures uniform heat distribution.