Shenzhen FOVA Technology Co.,Ltd
                                                                                                           
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Since 2020
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Tiny1-C Series Infrared Thermal Imaging Module 256x192 Resolution with 12μm WLP and Low Power Consumption

Price Negotiable
Price: Negotiable
MOQ: 10
Delivery Time: 10
Brand: FOVA
Product Description
Tiny1-C Series Thermal Imaging Module Overview

Advanced infrared thermal imaging module featuring shutter-less algorithm technology for clear thermal details with minimal power consumption. Designed for easy integration into various industrial and consumer applications.

Key Technical Specifications
Parameter Specification
Resolution 256×192 / 160×120 pixels
Focal Length Options 2.0mm, 3.2mm, 4.3mm
Industrial Measurement Range -15℃ to 150℃ (High Gain) / 50℃ to 550℃ (Low Gain)
Biological Measurement Range 30℃ to 45℃
Industrial Accuracy ±2℃ or ±2% reading value
Biological Accuracy ±0.5℃
Image Data Interface SPI / DVP
Core Features & Advantages
  • Shutter-less algorithm eliminates mechanical components for enhanced reliability
  • 256×192 resolution with 12μm wafer-level packaging
  • High frame rate performance for real-time thermal monitoring
  • Low power consumption design for extended operation
  • Consumer-class cost-effective solution
  • Excellent optical design and imaging quality
  • Easy integration with standard interfaces
Product Visualization
Tiny1-C Series infrared thermal imaging module showing compact design and thermal imaging capabilities

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen FOVA Technology Co.,Ltd
Location 23F, Building B, Fujian Building, No. 2048 Caitian Road, Fushan Community, Futian Street, Futian District, Shenzhen
Contact Person Allen

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