GSKL-650 Vertical Hot Air Curing Oven for PCB 67KW
Price:
USD+negotiable+pcs
MOQ:
1 PCS
Delivery Time:
1-7 days
Brand:
GS
Product Description
Material Frame Vertical Hot Air Curing Oven 67KW
Product Specifications
| Model | GSKL-650 |
|---|---|
| Applicable production range | Curing after dispensing or pasting of consumer electronics |
| Dimensions (mm) | 2150(L)*2050(W)*2150(H) |
| Weight (Kg) | <2000KG |
| Heating time | 10 minute |
| Temperature setting range | Room temperature – 200°C |
| Control method | PID closed-loop control +SSR drive |
| Number of temperature zones | 4 |
| Heating mode | Large circulation of hot air, two sides blowing and top return air |
| PCB board temperature distribution deviation | ±3.0°C |
| Min beat | 15S |
| PCB maximum size (mm) | 650(L)×460(W) |
| Rail width adjustment range | 80~460mm |
| Track width adjustment | Automatic width adjustment, and fixed track near the operating surface |
| Product flow | From left to right |
| Layer spacing | 20mm |
| Transport height (mm) | 950±30mm |
| Number of layers | 60 layers |
| Installed power | 67KW |
Product Features
- The transmission design minimizes jamming risk with no internal connection points for smooth transportation
- Intelligent fault layer shielding improves efficiency by allowing selective disabling of malfunctioning layers without affecting overall operation
- Adjustable operation range enables energy-saving small cycle actions without requiring products to pass through the top layer
- Innovative needle roller active transportation prevents jamming and plate damage, unlike traditional chain-driven systems
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Company
Global Soul Limited
Location
Room 205, 2/F, Bldg B, Tengjun Tech Park, Buxin K Rd, Area 73, Buxin, Xin'an, Bao'an, Shenzhen
Contact Person
Yi Lee