Four Layers PCB with Blind Buried Holes and Ceramic Substrate for High-reliability Applications
Price:
USD+negotiable+pcs
MOQ:
1 PCS
Delivery Time:
5-15 days
Brand:
GS
Product Description
PCB Manufacturing Four Layers Of Blind Buried Holes
Product Description
Specialized PCB manufacturing featuring four layers with blind and buried vias technology for advanced circuit board applications.
Key Features
- Four-layer PCB construction with blind/buried vias
- High-density interconnect technology
- Enhanced signal integrity and reliability
- Space-saving multilayer design
Applications
- High-frequency PCBs
- Impedance controlled circuits
- RF circuit boards
- Advanced electronic systems
Related Technologies
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Global Soul Limited
Location
Room 205, 2/F, Bldg B, Tengjun Tech Park, Buxin K Rd, Area 73, Buxin, Xin'an, Bao'an, Shenzhen
Contact Person
Yi Lee