The FUJI H02F HEAD is a high-performance placement solution designed for FUJI's NXT series of SMT (Surface Mount Technology) placement machines. This dual-nozzle head is engineered for high-speed and high-accuracy placement, making it a crucial asset in modern electronic assembly lines.

The FUJI H02F HEAD is designed for versatility, supporting a wide range of components from 1608 (0603") up to 74mm x 74mm. With its two nozzles, it enhances throughput while maintaining precision. The H02F HEAD is suitable for a variety of applications, including standard SMT components and larger or odd-shaped parts.

The FUJI H02F HEAD delivers high placement accuracy, ensuring the proper functioning of electronic circuits. The accuracy is achieved through Fuji's refined servo control and vision recognition technology.

Achieving a throughput of 6,700 chips per hour (CPH), the FUJI H02F HEAD maximizes production efficiency. Its high-speed operation ensures that assembly lines can meet the demands of high-volume manufacturing.

The FUJI H02F HEAD is designed to handle a variety of components, from small chips to larger components. Its dual-nozzle design allows for efficient handling and placement of a diverse range of parts.

• Nozzles: Different nozzle types accommodate various component sizes and shapes.
• Spare Parts: Availability of spare parts ensures minimal downtime.

The FUJI H02F HEAD is ideally suited for:

• High-volume manufacturing: Achieving high throughput in mass production environments.
• Diverse SMT lines: Adapting to various production needs with its flexible design.
• Placement of a wide range of components: Efficiently handling components from small chips to larger parts.

• High Speed: Enables rapid placement of components, maximizing production throughput.
• Precision: Ensures accurate placement, critical for the reliability of electronic devices.
• Versatility: Compatible with a wide range of component sizes and shapes.