MIRTEC MV-6E OMNI 3D AOI Machine with SPC Software 950KG
Price:
USD+negotiable+pcs
MOQ:
1 PCS
Delivery Time:
1-7 days
Brand:
MIRTEC
Product Description
MIRTEC 3D AOI MV-6E OMNI 950KG SPC Complete Statistical Software For Inspection
Key Specifications
| Attribute | Value |
|---|---|
| Model | MV-6E (OMNI) |
| PCB size | 50mm×50mm~480mm×460mm |
| Height accuracy | ±3um |
| Maximum component height | 5mm |
| FOV field of view | 58.56mm×58.56mm |
| 3D detection speed | 0.80 seconds /FOV/4.260mm²/ second |
| 2D detection speed | 0.30 seconds /FOV/ 10,716 mm²/ second |
| Weight | 950KG |
Detection Capabilities
2D Detection: missing piece, offset, skew, stellation, side stand, turn over piece, polar reverse, wrong piece, damage, tin, virtual welding, cavity, OCR
3D Detection: missing parts, height, position, more tin, less tin, missing welding, double chip, size, IC foot virtual welding, foreign matter, parts cocking, BGA cocking, climbing tin detection
Technical Features
- Accurate telecentric composite lens
- 8-segment color lighting system
- Complete statistical software (SPC)
- PCB clearance: 45mm
- PCB thickness: 0.5~5mm
- Minimum measurement size: 03015
- Servo motor positioning system
- Repeatability: ±10um
- DVLP 8-group moorfringe technology
Performance Highlights
- 100% testing capability for all materials on PCB
- Detection of character/screen print on mobile phone glass chips
- Effective inspection of PCBA coated with three anti-coating paint
- 15-megapixel high-resolution camera
The MIRTEC MV-6E(OMNI) is a complete 3D online optical inspection device featuring advanced detection capabilities, high-speed performance, and comprehensive statistical software for quality control in manufacturing processes.
Physical Specifications
Dimensions: 1080mm (W) × 1470mm (D) × 1560mm (H)
Power Supply: 200-240VAC 50Hz/60Hz
Air Source: 5KGf/cm² (0.5Mpa)
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Global Soul Limited
Location
Room 205, 2/F, Bldg B, Tengjun Tech Park, Buxin K Rd, Area 73, Buxin, Xin'an, Bao'an, Shenzhen
Contact Person
Yi Lee